-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Conversations on the Floor: IPC APEX EXPO 2018
April 11, 2018 | Steve Williams, The Right Approach Consulting LLCEstimated reading time: 4 minutes

This year’s show was one of the best in recent history, both in attendance and enthusiasm. The exhibit floor was sold out, and every single person I talked to was extremely optimistic about business in 2018. What follows are a series of observations and excerpts from conversations I had with some of the most interesting people I met.
Dr. Kunal Shah, Founder of LiloTree
Don’t let his PhD in material science fool you; Dr. Shah is just as likely to sit down with you over a beer and discuss sports as he is nanotechnology. Drawing upon his experience as a scientist with Intel, Shah found a niche as a problem solver for the who’s who of the aerospace and medical industries when he founded liloTree. OEMs and prime contractors come to liloTree to help solve processing and functional problems with both printed circuit boards and electronic components. Like an advanced thirdparty failure analysis lab, liloTree can investigate and determine the root cause of process and product failures. Where liloTree separates themselves is in their ability to solve the problem, either by finding an industry solution that already exists, or by developing one from theground up. The latter path led to the development of an industry game-changer, ENIG-Premium. Tasked with finding a solution for black pad, liloTree developed a proprietary barrier layer between nickel and gold that not only eliminates black pad, but also improves solder joint strength. Further, this proprietary process has applications in the semiconductor industry and is available right now.
Fred Long, Business Development with Matrix
Fred and I spent some time trying to top each other with stories from the “PCB good old days,” and I lost handily! Matrix is a supplier of printed circuit materials to the industry, and our discussion focused on Matrix’s new automation contributions to Industry 4.0, which was the buzz of the show. Fred briefed me on some innovative, automated panel cleaning equipment solutions Matrix released, which is generating a lot of interest. The most interesting development Fred discussed is the new cut sheet laminator and handling equipment that strips off the Mylar from the laminated panel. Literally minutes before I ran into Fred, I was speaking with a PCB client who was at the show solely to look at any new equipment that can reliably strip off Mylar on very thin substrates. He mentioned that he had just left the Matrix booth very excited with their technology.
Sanjay Huprikar, VP of Solutions with IPC
One of the charters of the IPC is to represent the electronics industry globally, and Sanjay was happy to report on the continued growth and expansion of the IPC in Europe. In fact, he mentioned that many of the new IPC standards under development are coming out of the European committees. As one of IPC’s four core pillars, Solutions includes a couple of exciting initiatives—Transportation and Workforce Development. One of the most interesting topics of discussion regarding transportation was the “electronification” of the modern automobile and the high level of PCB integration in the average vehicle. In an unrelated discussion with another client, he mentioned his new Cadillac SUV contained over 300 printed circuit boards! The most important new development from my perspective is the new workforce development program the IPC has rolled out to offer training and skills that the average PCB newbie will need in order to be successful in this industry. We talked about the lack of young people entering the trades and factory work, and that reversing this trend starts with education like IPC is providing.
Leo Lambert, VP/Business Development of EPTAC
EPTAC is the largest provider of IPC training in the United States and is often mistakenly thought of as part of IPC. Leo has been with EPTAC for a couple of decades and has witnessed firsthand the evolution of our industry (another opportunity for me to exchange “back in the day” stories). Most interesting was our discussion on the challenges EPTAC faces with the voluminous amount of constantly changing specifications they must not only be fully up to speed on, but also have training programs developed to support them. With a very compressed timeline from specification release to training requests, EPTAC is in a perpetual education mode. The company now has over 35 training classes to choose from, and 14 physical locations in the U.S. One course that is critical to most of my clients is IPC certification of inspection personnel. However, when asked which class is most popular, Leo said that hand soldering is by far the course that is used the most.
Matt Turpin, President of Zentech
As a client, Matt and I have known each other for quite a while, so I was interested in hearing his thoughts on the overall business climate. Like most of the folks I talked to, he was extremely optimistic at the business prospects for 2018 and beyond. The most interesting discussion we had involved the NIST Cybersecurity Framework, which is U.S. government guidance for private sector organizations that own, operate, or supply critical infrastructure. When I asked Matt, “Isn’t ITAR enough?” he laughed and said, “Not even close.” On a scale of 1-10, ITAR is a “1” and NIST is a “10.” The new NIST requires an order of magnitude higher level of security that covers people, networks, equipment, and infrastructure. Zentech has embraced this, and after spending considerable time, resources, and money in preparation, the company is now compliant. While NIST is officially “voluntary,” not being compliant is certainly a barrier to certain market sectors and customers, and extends throughout the entire supply chain of a company.
Editor's Note: This article originally appeared in the Show & Tell Magazine.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.