The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
Global Citizenship: The Global Push for Digital Inclusion
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
KIC to Discuss the Smart Factory Starter Kit at May SMTA Expos
April 11, 2018 | KICEstimated reading time: 1 minute
KIC announced that MB (Marybeth) Allen will discuss the retrofittable Smart Factory Starter Kit that contains all of the elements of the smart factory concept relating to reflow and curing ovens at the SMTA Wisconsin, Carolinas and Michigan Expos. The SMTA Wisconsin Expo & Tech Forum is scheduled to take place Tuesday, May 8, 2018 at the Milwaukee Airport Crowne Plaza in Milwaukee, Wisconsin. The Carolinas Expo & Tech Forum will be held Tuesday, May 15, 2018 at the DoubleTree Raleigh Brownstone in Raleigh, North Carolina, and the Michigan Expo & Tech Forum will take place Tuesday, May 22, 2018 at Laurel Manor in Livonia, Michigan.
Smart factories promise a leap forward in terms of productivity and control. The technology delivers consistent quality, significant lower production cost, traceability and customer value. The retrofittable starter kit includes:
- Machine optimization software
- Process transparency
- Extreme Automation
- Flexible production (eliminate changeover time)
- Connectivity
- Machine learning
- Real-time information and insight
- Reduced electricity use
Begin the road to a Smart Factory implementation with a low investment / low risk / narrow focus starter kit. You will advance up the smart factory learning curve which positions you well to take on the rest of the factory.
The KIC Smart Factory Starter kit for contains:
1 ea. The all-new KIC SPS 7 channel real-time Wi-Fi reflow Profiler
1 ea. KIC RPI (Reflow Process Inspection) or ProBot automatic systems
1 ea. The all-new KIC Vantage network insight factory software
(On-site visit by a KIC certified technician is included)
Move toward the future of line connectivity, flexible production, data analytics, process transparency, machine learning and real-time insight.
About KIC
Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.
KIC products include the KIC SPS, K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.
For more information about KIC, click here.
Share on:
Suggested Items
July 2025 PCB007 Magazine: Sales—From Pitch to PO
07/18/2025 |Though all parts of a company are essential for holistic success, it is a foundational truth that a company lives and dies by its sales. If there are no sales, the company eventually ceases to exist, or as Henry Ford says, “Nothing happens until someone sells something.” In the July issue of PCB007 Magazine, we break down the sales stack and provide a guide to up your sales game.
Tightening of LPDDR4X Supply Drives Up Prices; Smartphone Brands to Accelerate Adoption of LPDDR5X
07/17/2025 | TrendForceTrendForce’s latest investigations reveal that major Korean and U.S. memory suppliers are expected to significantly reduce or even cease production of LPDDR4X in 2025 and 2026.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.