Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

New Version of the Machine Vision Software MVTec MERLIC Focuses on Easier Integration

04/03/2025 | MVTec
Machine vision is playing an increasingly important role in the automation of industrial manufacturing processes.

IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies

04/03/2025 | I-Connect007 Editorial Team
During the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon. 

BrainChip Partners with RTX’s Raytheon for AFRL Radar Contract

04/03/2025 | BUSINESS WIRE
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI, today announced that it is partnering with Raytheon Company, an RTX business, to service a contract for $1.8M from the Air Force Research Laboratory on neuromorphic radar signaling.

BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges

04/02/2025 | BEST Inc.
BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.

Knocking Down the Bone Pile: Basics of Component Lead Tinning

04/02/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
The component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in