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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Don Dupriest Elected to Chair Top IPC Standards Leadership Committee
April 16, 2018 | IPCEstimated reading time: 2 minutes
Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC’s top standards development oversight committee for the past two years.
As a Lockheed Martin Fellow on Lockheed Martin’s Technical staff, Dupriest provides leadership in interconnect technology development for electronic manufacturing and is responsible for advanced technology, process development and product manufacturability for electronic systems.
An active IPC volunteer for more than 25 years, Dupriest has provided invaluable service to IPC. A previous chair of the TAEC, he is also a member of IPC’s Hall of Fame and President’s Award recipient. Dupriest currently co-chairs the IPC D-35 Printed Board Storage and Handling Subcommittee.
Dupriest was elected to the TAEC post while attending a mentorship meeting for IPC Emerging Engineers. “I have to admit I was surprised to hear I was elected – I guess this is what happens when you miss your first TAEC meeting in twenty plus years,” he joked. “The committee voted to change the rules to allow a second term.” Dupriest added, “I am honored to be chosen and trusted by my peers to lead and serve as the first second term chairman of the TAEC.”
Citing his goals for chairmanship, Dupriest stated, “I typically jump right in when approaching any task, so I plan to do that with the TAEC. We now have greater use of task groups within committees to speed up creating content and resolution of requirements under development, but there is always room for improvement.
“I’d like to see what else we can do to better execute standards development by revising the Project Initiation Number (PIN) process for each new document at IPC. I’d like the process to better describe potential influences on other general committees and documents; i.e., requirements that might be impacted by the new PIN, giving general chairs a broader idea of activities outside their purview that may be impacted by new document development. I am also interested in keeping the communication lines open between general chairs so that we keep one another informed.”
Mentioning his commitment to mentoring the next generation of engineers, Dupriest indicated his interest in bringing emerging engineers to TAEC meetings to give them an idea of what to expect once they are members of IPC.
For additional information on the IPC TAEC and its activities, click here.
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.