SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation Models
Punching Out: What Buyers Are Buying
‘Deepfake’ ComponentsAIM to Highlight REL Alloys at SMTA Empire
April 20, 2018 | AIM SolderEstimated reading time: 1 minute
AIM Solder is pleased to announce their participation at the SMTA Empire Expo & Tech Forum, scheduled to take place April 24, 2018 at the Holiday Inn Syracuse/Liverpool in Liverpool, New York. AIM will highlight their revolutionary REL61 and REL22 lead-free solder alloys, along with their full line of solder assembly materials.
AIM’s new alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22 is an award-winning, high reliability alloy with durability characteristics that double that of SAC305 in harsh environments. REL61 is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys. With a 10°C lower melting temperature and superior wetting performance, REL61 can lower process temperatures, prevent PCB damage, and reduce waste. AIM’s REL alloys are available in paste, wire and bar formats and are engineered for reliability, usability, and cost effectiveness.
AIM will also showcase its full line of advanced solder materials, including its solder pastes, liquid fluxes, tin/lead and lead-free alloys. To discover all of AIM’s products and services, visit the company at the SMTA Empire Expo & Tech Forum for more information and to speak with one of AIM’s knowledgeable staff members.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.
Share on:
Suggested Items
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
The SD11 Inkjet Printer and Ventec Giga Solutions
10/10/2024 | Marcy LaRont, PCB007 MagazineVentec expanded last year to provide greater portfolio solutions to its customers, all of which are aligned with Ventec’s core business in laminates and distribution products. I sat down with Ventec Giga Solutions’ Commercial Director Leigh Allinson, who is deeply rooted in both the PCB and supply chain sectors. He explores the innovative realms of the company and its cutting-edge SD11 inkjet printer. Leigh brings insight into the fabric of the electronics manufacturing industry through the lens of pushing technology limits and delving into the strategic expansions of Ventec Giga Solutions.
SolderKing Celebrates a Milestone of Growth and Innovation in Soldering Solutions
10/10/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, is celebrating six years of growth and success in the electronics and industrial manufacturing sectors.
ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
10/08/2024 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.