The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
Global Citizenship: The Global Push for Digital Inclusion
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
AIM’s Dillon Zhu to Present at SMTA China East Technical Conference
April 23, 2018 | AIMEstimated reading time: 1 minute
AIM Solder is pleased to announce that Dillon Zhu, Regional Technical Support Manager, will present at the SMTA China East Technical Conference taking place April 24-26, 2018 at the Shanghai World Expo Exhibition & Convention Center.
Mr. Zhu will present the results of an AIM study examining the effect of QFN I/O paste deposits on ground pad voiding. BTCs have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations and ground/thermal pads create a number of challenges, including tilting, poor solder fillet formation, difficult inspection and – most notably – center/ground pad voiding. Voids in ground pad solder joints can be difficult to control due to the variety of input variables that can influence their formation. Most of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
You can attend Mr. Zhu’s technical discussion on Tuesday, April 24, 2018 from 11:40-12:15 in Room No. 6, B2 at the conference.
About Dillon Zhu
Dillon Zhu is Regional Technical Support Manager for AIM and, with over 15 years of experience, is an expert in SMT manufacturing. Since joining AIM in 2008, he has assisted many clients in diagnosing and correcting SMT and wave solder production challenges.
Share on:
Suggested Items
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.