SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation Models
‘Deepfake’ Components
Global Citizenship: Our Strength Comes From Working TogetherAIM’s Dillon Zhu to Present at SMTA China East Technical Conference
April 23, 2018 | AIMEstimated reading time: 1 minute
AIM Solder is pleased to announce that Dillon Zhu, Regional Technical Support Manager, will present at the SMTA China East Technical Conference taking place April 24-26, 2018 at the Shanghai World Expo Exhibition & Convention Center.
Mr. Zhu will present the results of an AIM study examining the effect of QFN I/O paste deposits on ground pad voiding. BTCs have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations and ground/thermal pads create a number of challenges, including tilting, poor solder fillet formation, difficult inspection and – most notably – center/ground pad voiding. Voids in ground pad solder joints can be difficult to control due to the variety of input variables that can influence their formation. Most of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
You can attend Mr. Zhu’s technical discussion on Tuesday, April 24, 2018 from 11:40-12:15 in Room No. 6, B2 at the conference.
About Dillon Zhu
Dillon Zhu is Regional Technical Support Manager for AIM and, with over 15 years of experience, is an expert in SMT manufacturing. Since joining AIM in 2008, he has assisted many clients in diagnosing and correcting SMT and wave solder production challenges.
Share on:
Suggested Items
ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
10/08/2024 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
AIM to Present on Ultra-Miniature Component Assembly at SMT-Info
10/02/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.
Mycronic’s Jet Set Technology
10/02/2024 | Nolan Johnson, SMT007 MagazineIn this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.
Metcal Introduces New MicroFine Products for Soldering Under the Microscope
10/02/2024 | MetcalMetcal, part of OK International and Dover and a leader in benchtop soldering for electronics and industrial manufacturing, announced the launch of its new MicroFine soldering handpieces and cartridge tips for use under microscopes.