One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
The Knowledge Base: Challenges and Considerations of Harsh Environments
AIM’s Dillon Zhu to Present at SMTA China East Technical Conference
April 23, 2018 | AIMEstimated reading time: 1 minute
AIM Solder is pleased to announce that Dillon Zhu, Regional Technical Support Manager, will present at the SMTA China East Technical Conference taking place April 24-26, 2018 at the Shanghai World Expo Exhibition & Convention Center.
Mr. Zhu will present the results of an AIM study examining the effect of QFN I/O paste deposits on ground pad voiding. BTCs have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations and ground/thermal pads create a number of challenges, including tilting, poor solder fillet formation, difficult inspection and – most notably – center/ground pad voiding. Voids in ground pad solder joints can be difficult to control due to the variety of input variables that can influence their formation. Most of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
You can attend Mr. Zhu’s technical discussion on Tuesday, April 24, 2018 from 11:40-12:15 in Room No. 6, B2 at the conference.
About Dillon Zhu
Dillon Zhu is Regional Technical Support Manager for AIM and, with over 15 years of experience, is an expert in SMT manufacturing. Since joining AIM in 2008, he has assisted many clients in diagnosing and correcting SMT and wave solder production challenges.
Share on:
Suggested Items
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).
Technica USA and Electra Polymers: Driving Success in Ink Jet Solder Mask Across North America
02/27/2025 | Technica USATechnica and Electra Polymers have achieved remarkable success in the ink jet solder mask market. Electra Polymers is the dominant force in North America, holding an overwhelming market share north of 80% with its ElectraJet® EMJ110 solder mask.