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Unimicron Germany Rises from the Ashes with New Smart Factory
April 30, 2018 | Pete Starkey, I-Connect007 and Michael Weinhold, EIPCEstimated reading time: 9 minutes
Figure 25: Michael Weinhold with Peter Alliston.
Figure 26: Alun Morgan with Tamara den Daas and Kirsten Smit-Westenberg.
The main attraction of the evening was a popular rock band from Cologne called Brings, clad for some strange reason in tartan trews and kilts although I couldn’t work out any Scottish connection. Their music was a sort of heavy metal with an oompah beat. Loud—it certainly got the locals up and dancing until long after the sun had gone down.
Figure 27: The rock band, “Brings.”
Figure 28: Heavy metal oompah in tartan kilt.
Figure 29: Pete Starkey with Kirsten Smit-Westenberg and Thomas Michels.
Figure 30: Late in the evening.
It’s a rare and wonderful experience to be at the opening of a major new PCB production facility in Europe. It could so easily have gone the opposite way had it not been for the commitment of people like Gerard van Dierendonck and Rico Schlüter, their team of managers and engineers and their skilled workforce. These were surely the fundamental determining factors in Unimicron’s decision to maintain their strategy of providing a local one-stop-shop solution to European customers within the automotive, renewable energy and industrial sectors.
Although the Unimicron Germany facility has the capability and capacity to manufacture lot sizes up to 5,000 square metres, it is definitely not a volume production plant; it is the exemplary smart factory in every sense. My personal interpretation is that every panel is effectively a unique job in its own right; whether it belongs to a quick-turn prototype or a production runner it is treated the same, and its complete manufacturing, inspection and test history is recorded in every detail. I fear for the fortunes of smaller companies in Europe that do not have the resources to invest to the level of capability, automation, flexibility and traceability they would need to remain competitive with this kind of operation.
If you are interested to learn more, Rico Schlüter will present an introduction to the new Unimicron factory at the EIPC 50th Anniversary Summer Conference on June 21 – 22 in Dusseldorf when the highlight of the bonus programme will be a guided tour of the factory. You can register here.
Photography by Alun Morgan, EIPC
Page 6 of 6Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
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11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.