-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Ucamco Releases Specification for Fabrication Documentation in Gerber
April 30, 2018 | UcamcoEstimated reading time: 1 minute
Since decades Gerber is the standard for describing the images – copper layers, solder mask, drills – in PCB fabrication data. Attributes introduced with Gerber X2 ‘add intelligence to the image’ by identifying layers, vias, SMD pad, component pin numbers and reference designator.
But PCB fabrication data is not just about images - it includes fabrication documentation such as finish, overall thickness and materials. It is essential for the quoting, planning, engineering, CAM and fabrication of the bare and assembled board. It is often transferred informally, in drawings and texts, and handled manually, wasting time and risking errors. The Gerber Job File transfers this information in a machine-readable manner as part of Gerber fabrication data.
The extension is compatible with both Gerber X1 and X2. Existing image input/output code does not need to be changed when implementing the Gerber job file.
The Gerber hallmark of simplicity and human-readability is maintained.
The Gerber Job File is straightforward to implement. Partial implementations are allowed, even encouraged. Better a partial job file than no job file at all. Developers can pick and choose from the spec what suits them. Several software suppliers have already committed to support the new Gerber Job File.
The initial draft was published on the Ucamco website for public review by the Gerber community in March 2017. There was a lively discussion, the draft went through seven public revisions before being finalized early April 2018. It became much more practical in the process.
About Ucamco
Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photoplotting and direct imaging systems, with a global network of sales and support centers. Headquartered in Ghent, Belgium, Ucamco has over 25 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Systems Corp. (1998).
The specification and example files are available at the Gerber page, click here.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.