One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
The Knowledge Base: Challenges and Considerations of Harsh Environments
Indium to Introduce Indium Oxide Powder at SVC TechCon 2018
May 1, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will introduce its new Indium Oxide High BET powder designed to support emerging applications of the display industry at SVC TechCon from May 5-10 in Orlando, Florida, USA.
Indium Corporation’s Indium Oxide High BET powder is designed for use in both display electrodes and thin-film oxide transistors as part of the transparent conductive oxide (TCO) film stack.
Indium Oxide High BET powder offers:
- BET range from 13–17m2/g
- Higher than 4N5 purity
- Primary particle size between 50–100nm
This material supports the evolving needs of sputtering target production lines that need flexibility and the ability to scale in today’s fast-changing environment.
Indium Corporation’s reclaim capability includes a fully integrated manufacturing reclaim loop that provides a fast return-to-process time for our customers to lower inventory costs.
Visit us at booth #417 or find more information about our Indium Oxide products, click here.
Share on:
Suggested Items
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Expert to Present on Gold Solder Solutions for Medical Applications at IMAPS 2025 Workshop
02/26/2025 | Indium CorporationIndium Corporation Senior Product Specialist Jason Farrell will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop, taking place March 5-7 in Phoenix Arizona.
Indium Expert to Address Thermal Challenges at TestConX 2025
02/04/2025 | Indium CorporationIndium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
01/22/2025 | Indium CorporationIndium Corporation will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.
Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025
01/16/2025 | Indium CorporationIndium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.