-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
ACT Completes Acquisition of ECT
May 1, 2018 | ACTEstimated reading time: 1 minute
Additive Circuits Technologies LLC (ACT) is pleased to announce the conclusion of a corporate reorganization and the incorporation of assets acquired from EarthOne Circuit Technologies (ECT) and technology advancements for Autonomous Vehicles.
ACT is now supporting the former customer of ECT, and expanding production capacity in both the US and the EU. Additive Circuit Technologies will continue supporting products under the brand name and trademark of eSurface, in addition to products and services under Additive Circuits Technologies.
Additive Circuits Technologies primary business is manufacture and support engineering of high-durability, fine-featured printed circuit boards (PCBs) and radio frequency (RF) features for Aerospace, Military, and Autonomous Transportation sectors. Headquartered in Los Angeles CA, USA, the company supports work worldwide. The company’s business development is focused on critical needs in Autonomous Vehicles.
To support this effort, ACT is releasing the attached White Paper examining a series of technology advancements for RF features. These advances are improving range and signal fidelity for the Autonomous Vehicles the white paper summarizing the advancements and the impact on this sector.
Stephen Spoonamore, President and CEO of Additive Circuits Technologies said: “Additive Circuit’s technical ability to build extremely high-tolerance RF features allows Autonomous Cars and Trucks using our RF products to extend range and fidelity despite complex and noisy interference, constant vibration damage, salt, and even minor accidents.”
The following topics are covered in the white paper:
- ACT’s RF technology on ultra-smooth substrates allowing finer RF features designs
- Testing documenting fine line features allowing lower power usage at long range
- Low noise generation for RF at range in production process
- RF built on smoother substrates creating smoother transmission surfaces
- Future development of substrates to be built into edge coupled filters
For more information, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.