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Additive Circuits Technologies LLC (ACT) is pleased to announce the conclusion of a corporate reorganization and the incorporation of assets acquired from EarthOne Circuit Technologies (ECT) and technology advancements for Autonomous Vehicles.
ACT is now supporting the former customer of ECT, and expanding production capacity in both the US and the EU. Additive Circuit Technologies will continue supporting products under the brand name and trademark of eSurface, in addition to products and services under Additive Circuits Technologies.
Additive Circuits Technologies primary business is manufacture and support engineering of high-durability, fine-featured printed circuit boards (PCBs) and radio frequency (RF) features for Aerospace, Military, and Autonomous Transportation sectors. Headquartered in Los Angeles CA, USA, the company supports work worldwide. The company’s business development is focused on critical needs in Autonomous Vehicles.
To support this effort, ACT is releasing the attached White Paper examining a series of technology advancements for RF features. These advances are improving range and signal fidelity for the Autonomous Vehicles the white paper summarizing the advancements and the impact on this sector.
Stephen Spoonamore, President and CEO of Additive Circuits Technologies said: “Additive Circuit’s technical ability to build extremely high-tolerance RF features allows Autonomous Cars and Trucks using our RF products to extend range and fidelity despite complex and noisy interference, constant vibration damage, salt, and even minor accidents.”
The following topics are covered in the white paper:
- ACT’s RF technology on ultra-smooth substrates allowing finer RF features designs
- Testing documenting fine line features allowing lower power usage at long range
- Low noise generation for RF at range in production process
- RF built on smoother substrates creating smoother transmission surfaces
- Future development of substrates to be built into edge coupled filters
For more information, click here.
