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AIM to Highlight REL61 at TEC Warsaw
May 3, 2018 | AIM SolderEstimated reading time: 1 minute
AIM Solder is pleased to announce their participation at TEC Warsaw, scheduled to take place on May 17, 2018 at the Double Tree by Hilton Hotel & Conference Centre in Warsaw, Poland. AIM will highlight its novel REL electronic solders, REL22 and REL61.
These new alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22 is an award winning, high reliability alloy with durability characteristics double the reliability of SAC305 in harsh environments. REL61 is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys. With a 10°C lower melting temperature and superior wetting performance versus SAC305, REL61 can lower process temperatures, prevent PCB damage and reduce costs and waste.
In recent years, AIM has expanded its presence in Europe with the addition of a full-line manufacturing facility in Łódź, Poland. This fully-staffed facility also provides sales support and customer service alongside AIM’s unparalleled technical support.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.
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