-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TopLine Sees Growing Interest in CCGAs at NEPCON China
May 4, 2018 | TopLineEstimated reading time: 1 minute
TopLine exhibited at the recent NEPCON China conference and exhibition in Shanghai and noted a number of significant new directions in thinking with regard to component reliability, quality, and thermal management issues.
”There is growing Interest in CCGA column grid array packages in China,” states Martin Hart, TopLine’s CEO. “It's about reliability. I was impressed by the number of prospective customers visiting the TopLine booth who were seeking increased reliability by selecting CCGA packages because of the CCGA's ability to reduce stress directly caused by CTE mismatch.”
Participation in the show was TopLine's fifth straight year at NEPCON China in Shanghai. Featured products included CCGA column grid arrays and daisy chain BGA test vehicles.
TopLine’s CCGA column grid array IC packages are made with non-collapsible high-temperature solder columns for SMT soldering on PCBs. CCGA packages provide more compliance than BGA solder balls (ball grid arrays) to absorb stress caused by CTE mismatch and increase solder joint reliability under harsh operating conditions.
In addition, Hart noted an encouraging trend in improved perspective among electronics assemblers and packagers in China, in that “China continues to show evidence of migration away from copying low-end products. Instead, they're progressing toward producing high reliability systems.” Increasing knowledge about the benefits of solder columns and how to incorporate them into current and future products will aid this progress, Hart concludes. TopLine has been active in promoting its products in the China market for more than 20 years.
About TopLine
TopLine manufactures a wide range of daisy chain test components, column grid arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. For more information, click here.
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.