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SMTA Capital Chapter Meeting Set for May 15
May 4, 2018 | SMTAEstimated reading time: 1 minute
The SMTA Capital Chapter will host a chapter meeting on May 15 from 5:00 PM to 7:30 PM at EIT, Leesburg, Virginia. IPC--Association Connecting Electronics Industries has released the G revisions of the two most widely used standards in the electronic industry, and who better to present “What’s New in IPC J-STD-001G and IPC-A-610G” than William Graver, Senior Analyst and Master IPC Trainer.
William Graver has over 30 years of experience in the PCB and PCA manufacturing industry. Currently, Graver is a Senior Analyst at NTS’s facility in Hunt Valley, Maryland (NTS-Baltimore) where his main areas of focus are PCB/PCA Failure Analysis and IPC training. Graver holds MIT (Master IPC Trainer) certifications for IPC-A-600, IPC-A-610, IPC-6012, and IPC/WHMA-A-620.
Don’t miss out on this educational networking event that includes dinner and a facility tour prior to the presentation. Registration is free for members and $30 for non-members. Any new member who joins the chapter at this event can attend the next chapter meeting for free.
To RSVP, please click here.
The evening is scheduled as follows:
5:30-6:00 PM Registration, Networking & Dinner
6:00-6:30 PM Facility Tour
6:30-7:30 PM Presentation
The SMTA Capital Chapter Meeting Location:
EIT, 309 Kellys Ford Plaza SE, Leesburg, VA 20175
About SMTA: 30 Years Developing Solutions in Electronics Assembly
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.