Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Rheinmetall Establishes UK Center for Autonomous Systems

08/19/2026 | Rheinmetall
Rheinmetall is preparing for the next generation of warfare, while delivering world-class technology. To expedite the delivery and meet the demand for autonomous systems, Rheinmetall has opened a new Advanced Land Autonomy Centre of Excellence (ALACOE) in the United Kingdom, enhancing operational effectiveness across the region.

SEMICON India 2026 to Showcase India's Semiconductor Growth

08/19/2026 | SEMI
Reflecting this transformation, SEMI and the India Semiconductor Mission (ISM) today announced that Hon'ble Prime Minister Shri Narendra Modi will inaugurate SEMICON India 2026 on 17 September 2026 at Yashobhoomi (India International Convention and Expo Centre), New Delhi.

Follow the Story: The Business of Engineering

08/19/2026 | I-Connect007
Building great products requires great engineering, but building a successful engineering company requires something more. Leaders must make decisions about investments, acquisitions, workforce development, automation, sourcing, strategy, and innovation, all while navigating changing markets and emerging technologies. This collection of articles and columns explores the business side of technical leadership, by gathering perspectives from executives, engineers, entrepreneurs, and industry experts who understand that long-term success depends on more than technical excellence.

Technica USA Announces Strategic Partnership with Rehm Thermal Systems

08/18/2026 | Technica USA
Technica USA is pleased to announce a new strategic partnership with Rehm Thermal Systems. Under the distribution agreement, Technica USA will represent Rehm throughout the Western and South-West Central regions of the United States.

Lockheed Martin, Verizon and Partners Demonstrate Airspace Protection Tech

08/17/2026 | PRNewswire
Lockheed Martin, in collaboration with Verizon, NVIDIA, Keysight Technologies, ODC and Astris AI, recently showcased how commercial off-the-shelf (COTS) technologies can make detecting and tracking unmanned aircraft systems (UAS) more accessible, faster to deploy, and easier to scale for public and critical infrastructure protection.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in