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SMTA Launches Advanced Electronics Assembly Technologies Course

10/07/2026 | SMTA
The Surface Mount Technology Association (SMTA) announced a new Advanced Electronics Assembly Technologies course scheduled for November 10-12, 2026 from 9:00 AM to 1:00 PM US Central Time each day. Electronics industry veteran, Keith Bryant, instructs the course live via an online platform.

Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.

Indium to Highlight High-Reliability Solder, Low-Silver, and Thermal Management Solutions at Productronica India

09/02/2026 | Indium Corporation
With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance solder pastes, lower-cost, low-silver solder alloys, and thermal interface materials solutions at Productronica India, September 16-18, in Bengaluru, India.

BTU International Launches Aurora Vacuum Reflow Oven for High-Volume Manufacturing

08/26/2026 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies.

Knocking Down the Bone Pile: X-ray Inspection of Ball Grid Array Solder Joints

08/07/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) devices are ubiquitous in electronic products primarily due to their advantages, including compact packaging, greater durability than leaded devices, and improved performance from shorter signal paths. BGAs improve electrical performance by reducing inductance and capacitance between the internal silicon die and the PCB, resulting in superior signal integrity and faster operation speeds. BGAs also offer superior thermal performance by dissipating heat more effectively, reducing the risk of overheating.
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