-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Henkel’s Electrically Conductive Adhesive Technology Designed for Next-Gen Solar Device Assembly
May 21, 2018 | HenkelEstimated reading time: 1 minute
Leveraging its formulation leadership in electrically conductive adhesive (ECA) innovation, Henkel Adhesive Electronics has developed a series of ECAs designed to facilitate lower-cost, flexible, process-friendly assembly of solar devices. The LOCTITE ABLESTIK ICP 8000 series ECAs have been designed to elevate module performance and accommodate various assembly processes including shingled solar modules and cell interconnect ribbon bonding.
“More challenging solar cell processing due to thinner wafers and emerging new cell designs has illuminated the need for an evolution in electrical interconnect materials,” comments Jon Burke, Henkel Market Segment Manager for Solar. “This in combination with the cost pressures facing solar technology manufacturers, as well as the requirement for increased module output, has driven the development of Henkel’s latest line of next-generation electrically conductive adhesives.”
LOCTITE ABLESTIK ICP 8000 is a series of ECAs designed specifically for the demands of solar cell interconnect and in-use module performance. With a very low cost per watt, the new Henkel ECAs are among the most economical materials on the market. The formulations also offer exceptional processing and performance characteristics, including compatibility with wafer thicknesses of less than 160 µm; fast printing and dispensing capability at speeds of greater than 200 mm per second for high throughput; and full curing in less than 20 seconds at low temperatures between 110°C and 150°C, allowing maximum UPH and improving in-line inspection and yields.
“Not only are there processing advantages with LOCTITE ABLESTIK ICP 8000 electrically conductive adhesives, but in-use reliability and performance benefits as well,” notes Burke. “For both shingle stacking and ribbon bonding cell interconnect techniques, the new Henkel materials offer a more flexible solution than solder, absorbing the stress associated with CTE mismatches for improved reliability.”
With a broad technical support footprint, advanced R&D labs and material production in all major geographical regions, and experienced solar applications specialists around the world, Henkel’s PV technical consultation resources are unmatched. PV specialists interested in learning more about LOCTITE ABLESTIK ICP 8000 series ECAs and the company’s complete engineering services are invited to visit the Henkel technical team in Booth 250, Hall W4 at the upcoming SNEC PV Power Expo, taking place May 27-30 in Shanghai, China.
Suggested Items
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.