Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Koh Young Strengthens Support Network for the Americas
May 22, 2018 | Koh Young TechnologyEstimated reading time: 2 minutes
Whether solder paste inspection or automated optical inspection, the electronics assembly market has widely embraced Koh Young and its innovative 3D inspection technologies. For example, Koh Young has again bested its annual performance in terms of both units and revenue. In fact, it is quickly about to surpass its 12,000th machine installation. Yet, it could not realize the growth without an outstanding group of dedicated field and application engineers to support the growing number of customers in the Americas.
“The success of our 3D technology and AI-powered smart factory software is undisputed, and our expanding customer list validates the fact. While our remarkable growth continues, we are constantly adding key personnel to expand our world-class organization and ensure the highest levels of customer satisfaction,” said Juan Arango, Managing Director of Koh Young America.
In recent months, Koh Young America has expanded its direct service and support team with nearly 10 field-proven industry veterans. Thanks to this influx of inspection experts, Koh Young America continues to deliver the service our customers demand from an industry leader. What’s more, it is still growing. “Koh Young continues to evolve its product portfolio with novel technologies, applications, and processes,” said David Nemeth, Service Manager for Koh Young America. “As customers join the Koh Young family, my focus it to ensure their success, which begins with solid training, technical service, and applications support.”
"Koh Young is known for innovative true 3D measurement solutions, which are used everywhere from a single line shop to the largest EMS factories in the world. Our solutions help manufacturers reduce process defects and increase yield," stated Jermaine Ducree, a recently hired Field Engineer with Koh Young America. "Our industry experience, training, and connectivity allow us to provide customers with the highest level of support in the industry.”
Visit Koh Young at eSMART Factory in Sunnyvale, California on 24 May and explore how we can help you and your production challenges.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it has close contact with its growing customer base, while providing them with access to a global network of process experts. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.