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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Closing the Gap: Measuring 20-µm Spacing in Advanced SiP Packaging

09/18/2026 | Axel Lindloff, Koh Young Europe
Twenty microns does not leave much room for error. As advanced packaging increases functional density, the distance between neighboring devices is shrinking to dimensions that create an entirely new set of inspection challenges. In some system-in-package (SiP) applications, components approximately 200 to 300 µm tall can be separated by gaps of only 20 to 30 µm. Measuring those spaces accurately requires considerably more than simply increasing camera magnification. The challenge is optical access.

Key Considerations When Selecting an Aqueous Cleaning Agent

06/03/2026 | Adam Klett, Ph.D, KYZEN Corporation
Selecting the appropriate aqueous cleaning agent is one of the most consequential decisions in mitigating contamination risks in high-density designs. Highly dense electronic assemblies have introduced a new level of sensitivity to contamination. Reduced conductor spacing, bottom-terminated components, and elevated power densities significantly increase the risk that even minimal flux residues will lead to electrochemical migration, leakage currents, and long-term reliability failures.

Navigating the Hidden Hurdles: Mastering Return Path Discontinuities for Robust Signal Integrity

05/26/2026 | Stephen V. Chavez, Siemens EDA and PCEA
In the race toward higher bandwidth, tighter form factors, and faster time-to-market, engineering teams focus heavily on device performance, routing density, and advanced materials. Yet one of the most critical determinants of system success remains largely invisible—and too often underestimated: the integrity of the return path. Signal integrity (SI) failures rarely originate from the signal trace alone. More often, they stem from what designers don’t see—the disruption of the signal’s return path. These disruptions, known as return path discontinuities, are a leading cause of late-stage failures, unexpected EMI issues, and costly respins.

Innovative Flash Copper Plating Technology

05/21/2026 | Andreas Schatz and Mustafa Özkök, MKS’ Atotech
The continuous push toward higher functionality, miniaturization, and performance in modern electronic devices—such as smartphones, wearables, and advanced computing platforms—has intensified the demand for high-density interconnect (HDI) printed circuit boards. Central to HDI performance is the reliable formation of blind microvias (BMVs), which serve as critical interlayer connections in modified semi-additive processes (mSAP).

Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream

04/23/2026 | Team NCAB -- Column: Fresh PCB Concepts
When engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not. 
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