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RTW NEPCON China: Christian Koenen Stencil Technologies Ensure First Pass Yields
May 29, 2018 | Real Time with... NEPCON ChinaEstimated reading time: Less than a minute
Almost 70% of PCB assembly defects come from the solder paste printing process. The stencil is a key factor in this process because its tolerances and apertures affect the paste transfer efficiency, which in turn is among the main cause of failures down the line. In this interview, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve this process and ensure first pass yields.
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