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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Limited Seating at EIPC 50th Anniversary Conference
May 30, 2018 | Alun Morgan, EIPC ChairmanEstimated reading time: 1 minute
The past, the present and the future—these are the three elements of EIPC’s 50th anniversary conference being held in Dusseldorf, Germany, from June 21–22. Half a century has passed since EIPC was founded in the days when the PCB was more than just a commodity.
At the upcoming conference, there will be a first-class show with the conference on Day 1, culminating with a visit to Unimicron’s new multilayer factory in Geldern, the Tate Modern of the European PCB industry. This will be followed by a celebration dinner at the 14th Century listed and moated Walbeck Castle.
Day 1 will be the occasion in which Paul Waldner looks back over 50 years in the industry, while Hans Friedrichkreit unveils his metric crystal ball to compete with the imperial one that Walt Custer usually produces. From then on, there will be a wealth of technological discussions on topics such as traceability, PCB 4.0, and halogen-free laminates.
Day 2 is dedicated to flex for 5G, curved and stretchable PCBs, open-source language, organic surface preservatives, and lab-on-PCB technology, as well as the traditional glimpses into developments in applications, chemistries and supply chain management.
For the updated detailed conference program, click here.
For the conference registration form, click here.
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