-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Nordson MARCH Plasma System Wins VISION Award at NEPCON China
May 31, 2018 | Nordson MARCHEstimated reading time: 2 minutes
Nordson MARCH has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA plasma system at the recent NEPCON China 2018 event in Shanghai.
The RollVIA plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
The RollVIA is a completely self-contained plasma system with production-proven roll-to-roll material handling for flexible PCB manufacturing. The vacuum system, plasma chamber, control electronics, and 40kHz power supply are housed in a single enclosure for cost effectiveness. The integrated roll-to-roll material handling system ensures precise control of roll speed, tension, and edge guidance for substrates. Optical-based edge guide detection allows for reliable control during rewind operations. Substrate loading is simple with easy access to the load and unload sections via three doors. The system is configured for vertical processing so that equal plasma treatment can be applied to both sides of the substrate, maximizing product quality and throughput. The fast vacuum pump down and process cycle times further add to the throughput and productivity. It's configurable with 1, 3, or 5 plasma cells to meet process requirements.
"Receiving these awards from SMT China and EM Asia magazines is especially meaningful to us because the China market is an extremely important one for Nordson MARCH," said Desmond Hor, sales director, Nordson MARCH. "Nordson MARCH has had offices in China for many years to provide complete engineering, application, and sales support. The RollVIA system fits the China market because it presents unique vacuum and gas flow technology, electrode designs, and superior temperature management. The careful balance of these critical design elements and process recipe parameters deliver a system that creates the most uniform treatment for key applications like desmear and landing pad cleaning."
About Nordson MARCH
Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma treatment systems that improve product reliability and increase production yields. Delivering over 30 years of continuous innovation Nordson MARCH is a global leader in plasma processing technology for manufacturing semiconductors, printed circuit boards, microelectronics, and medical devices with offices and labs worldwide, including the USA, Europe, Singapore, China, Japan, and Korea. An expert staff of scientists and engineers is available to assist development of plasma processes. For more information, click here.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems that dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, test and inspect for quality, and treat and cure surfaces, and are supported by application expertise and direct global sales and service. Nordson serves many consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and support offices in nearly 40 countries. For more information, click here.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.