-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Nordson MARCH Plasma System Wins VISION Award at NEPCON China
May 31, 2018 | Nordson MARCHEstimated reading time: 2 minutes
Nordson MARCH has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA plasma system at the recent NEPCON China 2018 event in Shanghai.
The RollVIA plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
The RollVIA is a completely self-contained plasma system with production-proven roll-to-roll material handling for flexible PCB manufacturing. The vacuum system, plasma chamber, control electronics, and 40kHz power supply are housed in a single enclosure for cost effectiveness. The integrated roll-to-roll material handling system ensures precise control of roll speed, tension, and edge guidance for substrates. Optical-based edge guide detection allows for reliable control during rewind operations. Substrate loading is simple with easy access to the load and unload sections via three doors. The system is configured for vertical processing so that equal plasma treatment can be applied to both sides of the substrate, maximizing product quality and throughput. The fast vacuum pump down and process cycle times further add to the throughput and productivity. It's configurable with 1, 3, or 5 plasma cells to meet process requirements.
"Receiving these awards from SMT China and EM Asia magazines is especially meaningful to us because the China market is an extremely important one for Nordson MARCH," said Desmond Hor, sales director, Nordson MARCH. "Nordson MARCH has had offices in China for many years to provide complete engineering, application, and sales support. The RollVIA system fits the China market because it presents unique vacuum and gas flow technology, electrode designs, and superior temperature management. The careful balance of these critical design elements and process recipe parameters deliver a system that creates the most uniform treatment for key applications like desmear and landing pad cleaning."
About Nordson MARCH
Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma treatment systems that improve product reliability and increase production yields. Delivering over 30 years of continuous innovation Nordson MARCH is a global leader in plasma processing technology for manufacturing semiconductors, printed circuit boards, microelectronics, and medical devices with offices and labs worldwide, including the USA, Europe, Singapore, China, Japan, and Korea. An expert staff of scientists and engineers is available to assist development of plasma processes. For more information, click here.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems that dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, test and inspect for quality, and treat and cure surfaces, and are supported by application expertise and direct global sales and service. Nordson serves many consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and support offices in nearly 40 countries. For more information, click here.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/13/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.