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Happy’s Tech Talk #38: Novel Metallization for UHDI

05/07/2025 | Happy Holden -- Column: Happy’s Tech Talk
I have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.

Technica USA and CBT Introducing TiTAN Hybrid at IPC APEX EXPO 2025

03/18/2025 | Technica USA
The wait is over! Technica and CBT are proud to unveil TiTAN Hybrid, a groundbreaking innovation set to redefine the PCB industry. Designed for unmatched performance, efficiency, and adaptability, this cutting-edge laser imaging technology brings the future to you—today.

IDC Predicts: AI Spending to Exceed $30 Billion by 2027 for Personalized Customer Experiences

01/28/2025 | IDC
The recent IDC report, IDC FutureScape: Worldwide Chief Marketing Officer 2025 Predictions – APeJ Implications, predicts that In 2027, companies will spend more than US$30 billion on AI-related infrastructure, platforms, software, and services to support their ability to compete on highly personalized customer experiences.

Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies

10/24/2024 |  Rich DePoto, Uyemura
In this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.

Solder Printing: SMT007 Magazine—September 2024

09/03/2024 | I-Connect007 Editorial Team
In this issue of SMT007 Magazine, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging. Join us as we look at the latest in solder printing equipment, printable solder pastes, and the opportunities they present.
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