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Excellon Installs COBRA Hybrid Laser at Innovative Circuits

06/23/2025 | Excellon
Excellon is pleased to announce the successful installation of a second COBRA Hybrid Laser System at Innovative Circuits, located in Alpharetta, Georgia. The Excellon COBRA Hybrid Laser System uniquely combines both UV and CO₂ (IR) laser sources on a single platform—making it ideal for high-density prototype and production printed circuit boards (PCBs).

SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics

06/18/2025 | SEMI
FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.

SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics

05/01/2025 | SEMI
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.

ASMPT at the Optical Fiber Communication Conference and Exposition (OFC)

03/24/2025 | ASMPT
ASMPT, the world’s leading provider of pioneering solutions for advanced packaging and semiconductor assembly, will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at the ASMPT booth 5675 during the OFC 2025 trade event being held April 1-3 at the Moscone Center in San Francisco, California (USA).

NextFlex Launches $5M Funding Opportunity to Strengthen US Electronics Industrial Base

03/20/2025 | PRNewswire
NextFlex, the Department of Defense (DoD) sponsored manufacturing innovation institute focused on maturing hybrid electronics, released Project Call 10.0 (PC 10.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing.
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