It’s Only Common Sense Mastering the Follow-Up—The Key to Closing More Deals
Driving Innovation: Registration in PCB Production Throughout the Process
Dan's Biz Bookshelf: 'Getting Naked: A Business Fable'
Technica USA and CBT Introducing TiTAN Hybrid at IPC APEX EXPO 2025
March 18, 2025 | Technica USAEstimated reading time: Less than a minute
The wait is over! Technica and CBT are proud to unveil TiTAN Hybrid, a groundbreaking innovation set to redefine the PCB industry. Designed for unmatched performance, efficiency, and adaptability, this cutting-edge laser imaging technology brings the future to you—today.
Advantages of LED-Laser Hybrid Systems
- Enhanced Processing Speed – Hybrid exposure systems reduce PCB production time
- Energy Efficiency – LED technology reduces power consumption compared to traditional UV lamps
- Longer Lifespan – LED and laser sources have longer operational life, minimizing maintenance
- Higher Precision – Laser provides fine resolution, while LEDs ensure uniformity
- Eco-Friendly – No mercury (as in traditional UV lamps) and lower heat emission
The TiTAN Hybrid will provide customers with the industry's most consistent, accurate, repeatable, and productive direct imaging solution available at a very affordable price.
Technica USA invites customers to visit their booth #4110 to see the TiTAN Hybrid and learn more about CB Tech's exciting technology roadmap. During the show, the TiTAN Hybrid will be interacting with the SAA automation system.
See the TiTAN-Hybrid in action at IPC APEX EXPO in Technica’s booth, #4110!
Share on:
Suggested Items
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
ASMPT at the Optical Fiber Communication Conference and Exposition (OFC)
03/24/2025 | ASMPTASMPT, the world’s leading provider of pioneering solutions for advanced packaging and semiconductor assembly, will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at the ASMPT booth 5675 during the OFC 2025 trade event being held April 1-3 at the Moscone Center in San Francisco, California (USA).
NextFlex Launches $5M Funding Opportunity to Strengthen US Electronics Industrial Base
03/20/2025 | PRNewswireNextFlex, the Department of Defense (DoD) sponsored manufacturing innovation institute focused on maturing hybrid electronics, released Project Call 10.0 (PC 10.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing.
SCHMID Group Unveils Revolutionary Hyper Loop System (HLS) for Precision Etching with Sustainable Technology
11/07/2024 | SCHMID GroupThe SCHMID Group is excited to introduce the Hyper Loop System (HLS), an innovative solution setting new standards in etching technology by combining high efficiency with sustainable benefits.
HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models
10/30/2024 | TrendForceTrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.