-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
EIPC SpeedNews: News from the European PCB Industry
June 13, 2018 | EIPCEstimated reading time: 1 minute
- One week left! Register now for the EIPC 50th Anniversary Conference, June 21–22, 2018.
- 26. FED-Konferenz in Bamberg: Design- und Fertigungsprozesse für smarte Elektronik
- SMT Hybrid Packaging 2018 – Solution-oriented Initiator
- Apple to Make 20% Fewer New Model iPhones this Year
- When Factories Have a Choice Between Robots and People, It’s Best to Start with People
- Conductive Inks: Conformal 3D-shaped Coatings, Game-changing Success?
- ACB Workshop at NPL, June 27, 2018
- New Supervisory Board and Executive Board for Viscom AG
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Intel Foundry Push Gains Momentum With Apple as Potential Customer
05/13/2026 | I-Connect007 Editorial TeamApple’s reported decision to tap Intel as a manufacturing partner for future chips could mark one of the most significant shifts in the semiconductor supply chain in years, with implications that extend well beyond consumer electronics.
Tim Cook to Become Apple Executive Chairman; John Ternus to Succeed as CEO
04/22/2026 | AppleApple announced that Tim Cook will become executive chairman of Apple’s board of directors and John Ternus, senior vice president of Hardware Engineering, will become Apple’s next chief executive officer effective on September 1, 2026.
Apple Foldables May Capture Almost 20% Share as Stress Management Reduces Creasing
04/14/2026 | TrendForceTrendForce’s latest research on the display industry reveals that the foldable smartphone market is expected to see Apple enter as early as the second half of 2026, drawing significant attention to related technological advancements.
Apple Adds New Partners to its American Manufacturing Program
03/30/2026 | AppleApple announced new members of its American Manufacturing Program (AMP), expanding the company’s long-standing commitment to bring even more advanced manufacturing and critical component production to the United States.
Apple Leverages Supply Chain Control to Launch Lower-Priced Notebooks
03/05/2026 | TrendForceTrendForce’s latest projections estimate that global notebook shipments will decline 9.2% YoY in 2026, with the possibility of deeper contraction should demand remain weak.