Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Orange Co. Designers Council Meeting June 28 in Irvine
June 13, 2018 | Scott McCurdy, Freedom CAD ServicesEstimated reading time: 2 minutes
For the monthly Lunch ‘n Learn meeting on June 28, the Orange County chapter of the IPC Designers Council features two guest speakers with informative presentations on multiboard design and material solutions to address skew.
Presentation 1: Addressing the Challenges of Multiboard Design: Taking the “Big Picture” Approach to System Design
Speaker: Chris Carlson, CID, Senior Field Applications Engineer with Altium
As technology becomes more complex and miniaturized, the need for more complex multiboard systems arise. Clear lines between layout, mechanical and performance concerns begin to blur, which creates the need for PCB designers to take a more holistic view of the system.
In this presentation, Chris Carlson will discuss the unique and varied challenges that arise when doing multiboard system designs. He will review the considerations relative to partitioning the PCB, connection management, connector libraries and planning the layout. He will also discuss mechanical features, managing signals, thermal management, reliability, and power and signal integrity. Finally, Carlson will show how to ensure good mechanical fit by making the most of your 3D CAD functionality.
Presentation 2: Design and Manufacturing Developments to Lower Insertion Loss and Digital Pair Skew: What a Designer Needs to Know About Meeting 56Gb/S Speed Challenges
Speaker: Norm Berry, Director of Laminate and OEM Marketing, Insulectro
As frequency increases, differential pair skew and insertion loss become critical considerations for PCB design and manufacture. Add the ever-increasing complexity of reliable designs, while balancing value/cost performance, and the manufacturing options become more challenging. The designer needs to be aware of advancements in the base material manufacture and the options available to the fabricator.
Whether we are concerned with the demands of HDI designs with stacked, laser-drilled microvias or insertion loss on high-speed digital backplanes, the base material composite, with low-profile copper and a mechanically spread glass reinforcement, has a direct impact. Backplanes operating at 56Gb/s require the integration all these factors and the newly developed manufacturing technologies.
The cost is $10 at the door. Altium is sponsoring the event by helping with the cost of the lunches.
There are two ways to RSVP:
- Click here to RSVP online
- Email your RSVP to Scott McCurdy
Please RSVP no later than noon on Wednesday, June 27. Reserve a spot on your calendar on Thursday, June 28 from 11:30 am to 1:30 pm for this educational Lunch ‘n Learn event.
Location
Harvard Athletic Park (The multi-purpose room is at the SOUTH end of the athletic fields)
14701 Harvard Ave.
Irvine, California
92606
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.