Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Orange Co. Designers Council Meeting June 28 in Irvine
June 13, 2018 | Scott McCurdy, Freedom CAD ServicesEstimated reading time: 2 minutes
For the monthly Lunch ‘n Learn meeting on June 28, the Orange County chapter of the IPC Designers Council features two guest speakers with informative presentations on multiboard design and material solutions to address skew.
Presentation 1: Addressing the Challenges of Multiboard Design: Taking the “Big Picture” Approach to System Design
Speaker: Chris Carlson, CID, Senior Field Applications Engineer with Altium
As technology becomes more complex and miniaturized, the need for more complex multiboard systems arise. Clear lines between layout, mechanical and performance concerns begin to blur, which creates the need for PCB designers to take a more holistic view of the system.
In this presentation, Chris Carlson will discuss the unique and varied challenges that arise when doing multiboard system designs. He will review the considerations relative to partitioning the PCB, connection management, connector libraries and planning the layout. He will also discuss mechanical features, managing signals, thermal management, reliability, and power and signal integrity. Finally, Carlson will show how to ensure good mechanical fit by making the most of your 3D CAD functionality.
Presentation 2: Design and Manufacturing Developments to Lower Insertion Loss and Digital Pair Skew: What a Designer Needs to Know About Meeting 56Gb/S Speed Challenges
Speaker: Norm Berry, Director of Laminate and OEM Marketing, Insulectro
As frequency increases, differential pair skew and insertion loss become critical considerations for PCB design and manufacture. Add the ever-increasing complexity of reliable designs, while balancing value/cost performance, and the manufacturing options become more challenging. The designer needs to be aware of advancements in the base material manufacture and the options available to the fabricator.
Whether we are concerned with the demands of HDI designs with stacked, laser-drilled microvias or insertion loss on high-speed digital backplanes, the base material composite, with low-profile copper and a mechanically spread glass reinforcement, has a direct impact. Backplanes operating at 56Gb/s require the integration all these factors and the newly developed manufacturing technologies.
The cost is $10 at the door. Altium is sponsoring the event by helping with the cost of the lunches.
There are two ways to RSVP:
- Click here to RSVP online
- Email your RSVP to Scott McCurdy
Please RSVP no later than noon on Wednesday, June 27. Reserve a spot on your calendar on Thursday, June 28 from 11:30 am to 1:30 pm for this educational Lunch ‘n Learn event.
Location
Harvard Athletic Park (The multi-purpose room is at the SOUTH end of the athletic fields)
14701 Harvard Ave.
Irvine, California
92606
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.