-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Altus Takes Stock with a New Range of Component Counting
June 19, 2018 | Altus GroupEstimated reading time: 2 minutes

With the importance of increasing traceability of component management and the reduction in labour intensive procedures growing, Altus Group, a leading supplier of capital equipment in the UK and Ireland, has added new lines to help in this task, including the introduction of Scienscope batch and inline X-Ray component counting range.
Altus has reported a growing interest in companies looking to increase efficiency and accuracy of store management so that the ambition of a ‘lights-out’ factory, with fully automated systems, is recognised.
“We have added American company Scienscope to our list of pre-eminent suppliers,” said Joe Booth, Altus sales manager. “The company’s range of inspection solutions is very comprehensive and will help in our customer’s mission to become fully automated.
“We have clients who contact Altus with issues surrounding component management. They are having difficulty in keeping an accurate stock count and identifying where and why things have gone missing. The Scienscope component counting range will help solve this problem as it communicates with data management, providing complete inventory control.
“Scienscope is the only supplier with the capability of an inline system allowing for the highest level of automation in component counting on the market. Where other providers are limited to batch by their technology, due to the method of horizontal tube movement (scanning), we have been able to conveyorize the technology for our customers benefit.”
The Scienscope AXI-5100c is one of the most advanced, automated component counting system in the world. The fully automated system provides complete inventory control and by using an inline integrated conveyor system, it counts components quickly helping to save time and money and reduce labour avoiding a “line down” problem due to lack of a component.
Another recent addition, featured at the SMT Hybrid & Packaging expo, is the X-Spection 6000, a technologically advanced X-Ray inspection system. As with all X-SCOPE platforms, it includes every advanced s/w tool required for a wide variety of applications. With more tilt and a rotating work table, the X-Spection 6000 incorporates the best in flexibility.
Altus Group Ltd
Altus Group was formed in 2001 to support the UK and Irish market for Surface Mount Technology, capital equipment for every process, peripheral equipment, spares and consumables and most importantly excellent service support.
The Altus Group product line has evolved over the years with carefully selected suppliers who offer ‘best in class’ products at cost effective prices, from world leading brands.
The Altus Team has a network of highly skilled technical sales specialists, applications and service engineers, providing local support across the UK and Ireland.
In 2005 sister company Danutek was formed with offices in Hungary and Romania to service the needs of local customers and multi-national companies with manufacturing facilities in the Central and Eastern European marketplace.
For more information, click here.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.