-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Yamaha Reveals Total Line Solution at SMT Hybrid Packaging 2018
June 25, 2018 | Yamaha Motor IMEstimated reading time: 3 minutes
Yamaha Motor Europe IM Division has shown how surface-mount assembly can continue to boost productivity and quality control, by introducing new and advanced equipment at SMT Hybrid Packaging in Nuremberg.
“The advantages of our total line solution concept now extend further across the factory than ever, with the latest machines for inline solder paste inspection and component storage and handling,” said Mr. Ichiro Arimoto, YMEIM General Manager. “Visitors have been excited at the new opportunities we can offer to further raise productivity and quality, and reduce operating costs.”
Having promised to debut the latest YSi-SP solder-paste inspection (SPI) machine at the event, Yamaha showed how high-speed 3D inline inspection boosts efficiency by coordinating with other machines in the Yamaha total line, such as printing and placement. The YSi-SP consolidates multiple inspection modes, including high-precision with advanced algorithms, and super-high resolution, on one machine, with a single head, for maximum throughput and minimum operator workload. Augmenting the comprehensive standard features, options such as bonding inspection and foreign-matter inspection help customers target specific manufacturing challenges. YSi-SP also supports data-driven process improvement by capturing all pad images and measurements into Statistical Process Control (SPC) software.
A bonus for visitors to this year’s Yamaha booth, the new YST15 Intelligent SMD Storage System also made its European debut. The YST15 integrates tightly with Yamaha’s Total Line Solution through Factory Tools software to bring new efficiencies to automated component storage, retrieval and delivery to the point of use. Storing up to 1500 reels, and able to load or unload up to 27 reels in one batch, it coordinates with events on Yamaha SMT lines to extract the required devices from inventory in advance and ensure arrival at the right machine at the optimum time. It is also AGV-ready, to interact with automatic guided vehicles for component transportation in the factories of tomorrow.
Also new to European audiences in Nuremberg, the latest Σ-G5S II mounter raises the performance of Yamaha’s modular family to new heights. Maximum mounting speed is increased 20% to 90,000 cph, and Σ-G5S II also features improvements to the rotary direct-drive head, streamlined board feeding, and a redesigned buffer for handling larger PCBs. Proven features of the Σ-G5S are retained, including splice-free feeders, overdrive motion for front or rear component picking, and the efficient 1-head solution concept.
Visitors also met the YSM20R mounter, the latest in Yamaha’s Z:LEX high-efficiency modular family. Higher mounting speed and a new wide-scan camera for components up to 12mm x 12mm with time-saving on-the-fly recognition give an extra boost to flexibility and throughput. Customers can further enhance productivity by choosing from options including Yamaha’s Auto-Loading Feeder (ALF), Auto Tray Sequencer (ATS) for non-stop tray replacement, and non-stop feeder-carriage exchange system.
Visible across the exhibition booth, and bringing all the machines in the Yamaha line together, Yamaha’s Factory Tools 4.0 software suite introduced new features including customizable machine-to-machine communications to unleash the power of Industry 4.0 in electronics-manufacturing enterprises. With new real-time performance and feeder-status monitoring, database-driven traceability, and powerful statistical process control (SPC) features, Factory Tools 4.0 comprises over 20 applications to streamline setup and programming, manage assembly throughput and productivity, and provide traceability down to each individual component and the nozzle that placed it.
The Yamaha Factory Tools 4.0 software suite unifies the Yamaha Total Line Solution, connecting advanced manufacturing capabilities with enterprise management and decision-making.
The Yamaha booth at SMT Hybrid Packaging 2018 attracted visitors from across Europe, seeking solutions for higher levels of productivity and quality.
About Yamaha Motor IM
Yamaha Motor IM is a subdivision of Yamaha Motor Corporation. Yamaha IM surface mounters are highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.
Yamaha Motor IM has created a strong business in the surface mounter industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha Motor IM to offer a full line of machines for electric/electronic parts mounting and propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.
Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients. For more information, click here.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.