-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
U.S. Circuit Invests in MASS Via Fill Unit and Pola e Massa Planarizer
June 25, 2018 | U.S. CircuitEstimated reading time: 1 minute
Escondido-based PCB fabricator U.S. Circuit has recently invested in both a MASS VCP 5000-1 vertical vacuum via filling machine and a Pola e Massa Planarizer 650.
Designed for high productivity requirements, the VCP 5000-1 machine will allow U.S. Circuit to fill both through holes and blind holes on both sides of a board in just one cycle with either conductive or non-conductive paste.
Benefits of the new system include,
- Utilizing the vacuum, holes up to 1:40 aspect ratio can be filled
- Robust blind via process window utilizing full chamber vacuum
- Job set up time: typical
- Simple via fill head maintenance
- Heated heads for paste viscosity control
- Squeegee system removing excess plugging paste from the surface of plugged panels
- Reduces excess paste by 20 to 6 micron (0.8 to 2.0 mil)
The Planarizer 650 from Pola e Massa is a compact size solution with multiple vertical brushes that allows the removal an excess of applied paste from conductive holes during the PCB manufacturing process. It is an evolution of PeM’s patented previous multi-roll model and is suitable to deburr and remove paste in excess, avoiding holes ovalization. The 650 is equipped with 10 brushes to provide ultimate power and regional conformance.
President Mike Fariba stated, “These new machines will allow us to bring via fill projects in house, which in turn, will allow us to provide our customers with faster delivery and better pricing. Customer service is important to us, so we will continue to make more additions like these to our facility in order to improve our speed, capability and pricing.”
About U.S. Circuit
For over 33 years, U.S. Circuit has been a premier supplier of commercial PCBs and for the past several years a supplier for the military and aerospace market. U.S. Circuit has experienced continued growth in a challenging economy through consistently high performance, on-time delivery, superior quality and an emphasis on the highest level of customer service. U.S. Circuit is proud to be the circuit board manufacturer for more than 400 growing companies.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.
Indra Signs Agreement with AXISCADES to Boost Production of Cutting-Edge Systems in India
06/18/2025 | PRNewswireParis Air Show -- Indra and the Indian technology company AXISCADES have signed an agreement to collaborate on the production of solutions for the aerospace and defense markets.
GKN Aerospace Delivers First High Voltage EWIS System for Clean Aviation’s SWITCH Project
06/16/2025 | GKN AerospaceGKN Aerospace has completed and delivered the first high voltage Electrical Wiring Interconnection System (EWIS) for the Clean Aviation SWITCH project.