Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Flex Receives Lenovo Diamond Award
June 25, 2018 | FlexEstimated reading time: Less than a minute
Flex recently received the Diamond Award, the highest recognition Lenovo presents to select global suppliers and partners, for the delivery of high quality, on time, innovative support and outstanding services.
This is the second time Flex has been honored with the Diamond Award, with only a handful distributed each year among thousands of suppliers. Flex provides Lenovo with a range of services including Sketch-to-Scale® solutions, build-to-order and configure-to-order operations, high volume manufacturing, logistics, and direct distribution across eight facilities around the world.
“We are very proud of our long-standing, strategic partnership with Lenovo, and what we’ve achieved together creating high-performance PCs, phones, and servers,” said Doug Britt, business group president at Flex. “Flex is honored to receive the Diamond Award, as recognition of our focus on delivering services and solutions that consistently exceed customer expectations.”
About Flex
Flex is the Sketch-to-Scale® solutions provider that designs and builds Intelligent Products for a Connected World®. With approximately 200,000 professionals across 30 countries, Flex provides innovative design, engineering, manufacturing, real-time supply chain insight and logistics services to companies of all sizes in various industries and end-markets. For more information, visit flex.com.
Share on:
Suggested Items
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
All Flex Solutions Upgrades Lamination Layup
06/22/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.