Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
Indium’s Seven Liang to Present at CEIA Guiyang Seminar
July 10, 2018 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the CEIA Guiyang Seminar on July 26 in Guiyang, China.
Liang’s presentation, How Solder Materials Influence Reliability, will review how materials can be used to solve some of the top industry challenges including head-in-pillow, non-wet opens, graping, and SIR performance. He will also discuss what materials to use to ensure the high reliability of the final assembly and share the methods and test results of high-reliability alloys.
Indium Corporation will also be exhibiting at the seminar. Their booth will feature their high-reliability, low-voiding products, such as Indium8.9HF Solder Paste, Indium10.1HF Solder Paste, and precision gold-tin preforms. Technical experts will be available at the booth to answer questions about the presentation and help resolve customers’ assembly challenges.
Liang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.
Rehm Academy Expands Its Training Program
08/28/2025 | Rehm Thermal SystemsThe demands on modern industrial companies and employees continue to rise, and therefore, the topic of further education is becoming increasingly important today.
MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider
08/28/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
ZESTRON Expands Capabilities with Addition of the EPS by i-Tech AG 75 Pallet Cleaning System
08/26/2025 | ZESTRONZESTRON, the global leader in high-precision cleaning solutions and services, is excited to announce the addition of a new capability in its Technical Center in Manassas, VA: