Nolan’s Notes: Looking Deep Into the Future With X-ray
Knocking Down the Bone Pile: Basics of Component Lead Tinning
Standard of Excellence: Anticipating Customer Needs Early and Often
AIM Solder Receives Best Presentation Awards at SMTA China East Technical Conference
July 12, 2018 | AIM SolderEstimated reading time: Less than a minute
AIM Solder's Dillon Zhu and Derek Wang have received Best Presentation awards for their respective technical sessions at the SMTA China East Technical Conference in Shanghai.
Zhu’s presentation, titled “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction,” generated great interest among attendees. This study highlighted stencil and reflow modifications that can be deployed to consistently and repeatedly reduce void formation on BTC style devices.
Wang’s presentation focused on AIM’s new REL alloys, which were developed to provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings.
Zhu is a regional technical support manager for AIM and, with over 15 years of experience, is an expert in SMT manufacturing. Since joining AIM in 2008, he has assisted many clients in diagnosing and correcting SMT and wave solder production challenges.
Wang is a technical support manager for AIM Solder. He is an SMTA Certified Engineer and also serves as a SMT Processes Trainer. With over 13 years’ experience in the SMT industry, Wang supports AIM customers in Eastern China.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.