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Advanced Electronics Packaging Digest

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Below the Surface: What Engineers Find Challenging About High Frequency Signal Integrity

09/17/2026 | Chandra Gupta -- Column: Below the Surface
How do materials affect RF signal performance? It’s a fair question, and most will assume they already understand the answer. But this misunderstanding is exactly why so many high frequency designs underperform, require rework, or worse, fail in the field. Below the surface, where signal integrity is either preserved or destroyed, the truth is that at high frequencies, material selection matters, and that’s where most engineers get it wrong.

Connect the Dots: What PCB Designers Should Know About Materials

09/10/2026 | Matt Stevenson -- Column: Connect the Dots
What questions does your manufacturer ask when they receive a design? I can tell you one: “How will we build this?” Every PCB design has specific parameters for elements such as impedance, thermal conductivity, and SI. Designers choose material properties based on the functionality requirements of the boards they design. Does the PCB have to operate in high heat? Be flexible enough to fit into a tiny device, such as a wearable? Maintain SI without distortion or data degradation?

Soctera Raises $4M to Advance Thermal Solutions for Defense and Space

08/12/2026 | PRNewswire
Soctera, Incorporated has closed $4 million in seed funding backed by Anorak Ventures and Multiball Capital, with additional participation from 9Yards Capital, Mana Ventures, and Red Bear Ventures.

Gilat Demonstrates AI-Based Interference Detection Technology for Satellite Links

08/07/2026 | Globe Newswire
Gilat Satellite Networks Ltd., a worldwide leader in satellite networking technology, solutions, and services, announced the successful demonstration of a breakthrough AI-based interference detection and cancellation technology for satellite communication links.

Molex Launches MiniMix Connectors for Humanoid Robotics

08/06/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems.
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