Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Qnity Advances Node Materials Innovation with KLA Inspection Technology

08/20/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the installation of a Surfscan® SP7XP unpatterned wafer defect inspection system from KLA as part of its ongoing investment in advanced semiconductor materials innovation.

Lam Research to Invest $3B+ to Expand Global Labs for AI Era

08/18/2026 | Lam Research
Lam Research Corp. announced that it intends to invest more than $3 billion over the next five years to expand its global research and development (R&D) lab network.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Foxconn Acquires Land in Tucheng Industrial Zone as a Future Operational Plan

08/17/2026 | Foxconn
Foxconn Precision Industry Co., Ltd. announced that its board of directors has approved the purchase of land and buildings located at No. 28 , Zhongshan Road, Tucheng District, New Taipei City from Xinhong International Investment Co., Ltd.

BAE Systems Advances to Phase 2 of DARPA's THREADS Program

08/13/2026 | BAE Systems
BAE Systems' FAST Labs™ research, development and production organization has successfully completed Phase 1 of the Defense Advanced Research Projects Agency's (DARPA) Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program and has been awarded continued support to move into Phase 2.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in