-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Technology Receives KOSDAQ Industry 4.0 Pioneer Award
July 17, 2018 | Koh Young TechnologyEstimated reading time: 2 minutes
Koh Young Technology has been recognized by Korea Exchange trading board KOSDAQ (Korean Securities Dealers Automated Quotations) with the KOSDAQ "Industry 4.0 Pioneer Award" for its excellence in putting Industry 4.0 into practice. The company received the award during the 10th annual KOSDAQ Awards Ceremony held on June 26, 2018. The expert panel of judges evaluated Koh Young's KSMART solutions and its surgical robot under development to be the best examples of the Industrial 4.0 revolution.
Pioneer with innovation embedded in its DNA
Since its establishment in 2002, Koh Young has shifted prevailing industry paradigms through its continuous innovation. The company has also aggressively invested in R&D with over 600 patents applied at home and abroad – registering over 400 patents as of 2017. Nearly half of its 520+ employees are researchers working in R&D centers around the world, including the prestigious Korea Advanced Institute of Science and Technology (KAIST).
Data, machines, and processes
Hardware is a core component of Koh Young's business. However, this is not the only key to its continued success. With the rapid adoption of Industry 4.0, more manufacturers are working hard to improve quality assurance by using big data analytics to examine production processes. With over 15 years of expertise providing ultra-precise 3D SPI (solder paste inspection) and 3D AOI (automated optical inspection) solutions, Koh Young provides quantitative measurement data with high repeatability and accuracy. Furthermore, KSMART helps Koh Young provide its customers with real-time data management, analysis, and optimization tools.
Networking production elements across an entire factory is one of the most important goals of Industry 4.0. Koh Young sees this not only as more than an internal goal; it is a collaborative mission to achieve with its partners. The KSMART Process Optimizer (KPO) is an excellent example, which can provide real-time feedback to mounters and printers. The closed-loop communication between machines helps automatically adjust parameters by exercising AI-powered algorithms.
Going beyond SMT with robotics
Koh Young is going beyond its Industry 4.0 leadership position by integrating its 3D measurement technologies with robotic applications. The company is drawing a collaborative future, where robots and humans work hand-in-hand to maximize process efficiencies. For example, the Koh Young compact surgical robot, called IST-Guide, provides surgeons with an increased level of dexterity through intelligent machine vision systems. Because the system is ideally suited for extremely demanding deep brain stimulation, Koh Young is expecting wide adoption to address myriad surgical procedures.
About Koh Young Technology, Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure Koh Young maintains close communication with its growing customer base, while providing them with access to a global network of process experts.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.