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Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

KONGSBERG to Build Polish Plant for Counter-Drone Systems

10/13/2026 | KONGSBERG
Kongsberg Gruppen ASA (KONGSBERG) is establishing a new manufacturing facility for sustainment and manufacturing of Counter-Unmanned Aerial Systems (CUAS) systems in Poland.

Adani Enterprises, Jabil Plan 50:50 Data Center Hardware JV

10/13/2026 | BUSINESS WIRE
Adani Enterprises Limited (AEL), the flagship company of the Adani Group, and Jabil Inc. , a global engineering, supply chain and manufacturing company, have signed a non-binding Memorandum of Understanding (MoU) setting out the framework for a proposed 50:50 joint venture to manufacture and assemble artificial intelligence (AI) and data center equipment in India.

Army Assessment Validates Trust Automation’s SUADS in Combat Training

10/12/2026 | Globe Newswire
Trust Automation, Inc., a leading Program Of Record C-UAS provider to The Department of War and a three-decade leader in actuation and power systems for defense and commercial industries, announced the successful completion of a U.S. Army operational assessment of its Small-Unmanned Air Defense System (SUADS) during National Training Center rotation 26-08 at Fort Irwin, California.

GlobalFoundries, TSMC Agree on U.S. Silicon Interposer Supply for AI Packaging

10/12/2026 | GlobalFoundries
GlobalFoundries (GF) announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems.
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