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Northrop Grumman’s Protected Tactical SATCOM Rapid Prototype Payload Assembled, Begins Space Vehicle Integration

01/07/2025 | Northrop Grumman
Northrop Grumman Corporation successfully completed assembly and testing of its Protected Tactical Satcom Rapid Prototype (PTS-P) payload and delivered it to the company’s facility in Gilbert, Arizona, where it will be integrated with an ESPAStar-HP bus and next-generation digital processing subsystem.

RTX's Raytheon Awarded $590M Production Contract for Next Generation Jammer Mid-Band

12/09/2024 | Raytheon Company
Raytheon, an RTX business, has been awarded a $590 million follow-on production contract from the U.S. Navy for the Next Generation Jammer Mid-Band (NGJ-MB) system.

ASMPT: Innovative Bonding for Power Electronics

12/09/2024 | ASMPT
ASMPT presents with its SilverSAM™ SilverSAM machine a highlight for makers of modern power electronics: an innovative and versatile silver sintering machine that meets the great demands on bonding, which is particularly critical in the field of electromobility. SilverSAM sets new standards in interconnect technology for power electronics, particularly in the rapidly growing electric vehicle market.

HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor

12/03/2024 | HyRel
HyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.

Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency

11/21/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
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