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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Summer Issue of Flex007 Magazine Available NowJuly 25, 2018 | Andy Shaughnessy, Flex007 Magazine
Estimated reading time: Less than a minute
An increasing number of OEMs are being forced into using flexible and rigid-flex circuits, for a variety of reasons: Sometimes rigid boards won’t fit the shrinking enclosures anymore, or the companies just need rugged, reliable circuits.
In the July 2018 issue of Flex007 Magazine, our contributors discuss some of the hurdles they faced when they dove into flex and rigid-flex circuits, and they offer advice to anyone considering a move into the flexible arena.
Be sure to download the PDF copy or future reference. The PDF is great for beach reading!
The “OE-A Competition 2024” shows the many possibilities of flexible, organic, and printed electronics with inspiring products, prototypes, and fresh designs live at LOPEC 2024, the leading international exhibition and conference for flexible, organic, and printed electronics in Munich.
All Flex Solutions has started the equipment build-out of a completely new flexible circuit manufacturing facility in Minneapolis. The building was purchased in 2020, and was completely renovated to accommodate the company’s plans for a brand new state-of-the-art flexible circuit fabrication plant.
Flexible circuits consist of conductive strips in a sandwich of insulating or dielectric material. They resist moisture and contamination and are insulated from external shorts, with holes or contact surfaces for interconnection. Understanding a package’s electrical requirements and not over-designing permits means taking full advantage of a flexible circuit’s potential compared to conventional wiring.
Ahead of Enlit Europe, Intel announced that its technology is helping power the Edge for Smart Secondary Substations (E4S) Alliance’s new solution to modernize the energy grid.
HyPerStripes project partners will create a technology platform including manufacturing techniques for roll-to-roll (R2R) processing as well as the integration of electronic components onto very long ("endless"), flexible and stretchable printed circuit boards.