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Summer Issue of Flex007 Magazine Available Now
July 25, 2018 | Andy Shaughnessy, Flex007 MagazineEstimated reading time: Less than a minute
An increasing number of OEMs are being forced into using flexible and rigid-flex circuits, for a variety of reasons: Sometimes rigid boards won’t fit the shrinking enclosures anymore, or the companies just need rugged, reliable circuits.
In the July 2018 issue of Flex007 Magazine, our contributors discuss some of the hurdles they faced when they dove into flex and rigid-flex circuits, and they offer advice to anyone considering a move into the flexible arena.
Check it all out this month in Flex007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Be sure to download the PDF copy or future reference. The PDF is great for beach reading!
Suggested Items
Ventec Giga Solutions & Hi-Print Team up to Launch World's First 3-Color Inkjet Printing Solution
07/24/2024 | Ventec International GroupVentec Giga Solutions, Ventec’s value-added PCB equipment division, and leading inkjet printer manufacturer Hi-Print have teamed up to launch the industry’s most cutting-edge inkjet printer for solder mask technology.
Global Flexible Substrate Market Size To Worth USD 2520.19 Million by 2033; CAGR Of 14.50%
07/16/2024 | Globe NewswireThe Global Flexible Substrate Market Size is to Grow from USD 650.62 Million in 2023 to USD 2520.19 Million by 2033, at a Compound Annual Growth Rate (CAGR) of 14.50% during the projected period.
SEMICON West 2024 Preshow Interview, FLEX Conference Review
07/03/2024 | Marcy LaRont, PCB007 MagazineIn this preshow interview for SEMICON West 2024 and the FLEX Conference, we dive into the dynamic world of semiconductor and flexible electronics, revealing cutting-edge insights from industry leaders with SEMI’s Samer Bahou, Gity Samadi and Julie Rogers and Bob Praino from Chasm Advanced Materials who advises the FLEX program. Set against the backdrop of the prestigious Moscone Center in San Francisco, the discussion traverses the history, evolution, and future directions of this critical sector, spotlighting the CHIPS Act, the importance of flexible and hybrid electronics technology for the sector going forward, and touches on issues such as sustainability and workforce. Here’s why you should be attending SEMICON West 2024 and FLEX Conference.
Mustaches and Automation in Flexible PCB Fabrication
06/24/2024 | Chris Clark, Flexible Circuit TechnologiesIn any manufactured product, whether a house or a flexible circuit, there is always a raw material component in the overall cost. In the flexible circuit, flexible heater, and rigid-flex industry, sheet materials can account for 20–60% of the overall price. Admittedly, this is a very broad range, but factors, such as how common the materials are in the region where they are made, can cause this to swing one way or the other. Your actions as an engineer or sourcing agent have an impact on overall cost, which I’ll illustrate through the example of building a house.
OE-A at ICFPE 2024, Taipei, Taiwan
06/11/2024 | OE-AThe International Conference on Flexible and Printed Electronics (ICFPE 2024) takes place from August 28-30, 2024, in Taipei, Taiwan. OE-A is a partner of this event and organizes a conference session.