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Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
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Summer Issue of Flex007 Magazine Available Now
July 25, 2018 | Andy Shaughnessy, Flex007 MagazineEstimated reading time: Less than a minute
An increasing number of OEMs are being forced into using flexible and rigid-flex circuits, for a variety of reasons: Sometimes rigid boards won’t fit the shrinking enclosures anymore, or the companies just need rugged, reliable circuits.
In the July 2018 issue of Flex007 Magazine, our contributors discuss some of the hurdles they faced when they dove into flex and rigid-flex circuits, and they offer advice to anyone considering a move into the flexible arena.
Check it all out this month in Flex007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Be sure to download the PDF copy or future reference. The PDF is great for beach reading!
Suggested Items
Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
03/03/2025 | Joe Fjelstad -- Column: Flexible ThinkingFlexible circuit technology came on the scene as a solution largely for niche applications, however, the technology has emerged in recent years as a cornerstone of modern electronics. Today, the technology is enabling a broad range of new product designs across industries. From wearable devices and medical implants to foldable smartphones and numerous automotive applications, flexible circuits are arguably at the heart of much of the next generation of innovations.
Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces
02/28/2025 | PRNewswireNeural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.
Growth and Innovation at FCT
02/26/2025 | Marcy LaRont, I-Connect007During DesignCon, I met with Tony Plemel, senior applications engineer at Flexible Circuit Technologies (FCT), to discusses the company’s growth and expansion opportunities, including its expansion of its inTFlex EMS facility. In this interview, Tony explains how FCT’s commitment to customer service and focus on communication and responsiveness allow the company to leverage its capabilities for continued expansion.
CEE PCB Appoints Markus Voeltz to Business Development Director Europe
02/12/2025 | CEE PCBCEE PCB, a leading manufacturer of printed circuit boards (PCBs) and flexible printed circuits (FPCs) with 3 production facilities in China, is expanding its presence in Europe and will offer local support starting March 2025.
Flexible PCB Market Size Projected to Reach $50.90 Billion by 2030
01/27/2025 | BUSINESS WIREThe global flexible printed circuit boards market size is projected to reach USD 50.90 billion by 2030, expanding at a CAGR of 13.7% from 2025 to 2030.