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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Remtec to Participate in EMS Industry Fly-In: Where Policy Meets the Production Line in Washington, D.C.

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President and CEO of Remtec, Brian Buyea Will Join The Industry Leaders in Advocating for a Stronger, More Resilient U.S. Electronics Manufacturing Base

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GPV has joined the Responsible Business Alliance (RBA) as an Affiliate Member.

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

WHMA Announces 2027 Annual Global Leadership Summit for Wire Harness Industry Leaders

09/16/2026 | Global Electronics Association
The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry. 
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