-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Aspocomp Raises Sales Outlook for 2018
July 30, 2018 | AspocompEstimated reading time: 1 minute
PCB manufacturer Aspocomp Group Plc has upgraded its outlook for full-year 2018 net sales and operating result. For 2018, the company expects net sales to grow over 10% and the operating result to double compared with 2017. Last year, net sales amounted to EUR 23.9 million and the operating result to EUR 0.8 million.
Customer demand improved substantially in the second quarter of 2018 and is expected to remain strong during the rest of 2018.
In its previous outlook for 2018 (issued on February 15, 2018, and repeated on April 19, 2018), Aspocomp estimated that its net sales would grow approximately 10 percent and the operating result would be better than in 2017.
Aspocomp’s half-year financial report for the period January 1 to June 30, 2018 will be released on Thursday, August 9, 2018.
Aspocomp – A Service Company Specializing in PCB Technologies
A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services over the entire lifecycle of a product. The company’s own production and extensive international partner network guarantee cost-effectiveness and reliable deliveries.
Aspocomp’s customers are companies that design and manufacture telecommunication systems and equipment, automotive and industrial electronics, and systems for testing semiconductor components for security technology. The company has customers around the world and most of its net sales are generated by exports.
Aspocomp is headquartered in Espoo and its plant is in Oulu, one of Finland’s major technology hubs. For more information, visit www.aspocomp.com.
Suggested Items
Aspocomp to Showcase Expertise at European Microwave Exhibition
09/16/2024 | AspocompAspocomp, a leading provider of advanced printed circuit board (PCB) solutions, is excited to announce its participation at the European Microwave Exhibition (EuMW) 2024.
Inside Information, Profit Warning: Aspocomp Lowers Guidance for 2024
08/29/2024 | AspocompAspocomp Group Plc lowers its financial guidance for the year 2024. Aspocomp now estimates that its net sales for 2024 will be below the 2023 level, and its operating result for 2024 will be clearly below the 2023 level. In 2023, net sales amounted to EUR 32.3 million and the operating result was a loss of EUR 1.7 million.
Manu Skyttä Starts as the President and CEO of Aspocomp Group Plc
05/20/2024 | GlobeNewswireManu Skyttä, MSc, Aeronautical Engineering, who was appointed as the new President and CEO of Aspocomp Group Plc in February, starts his position today. The Company issued a release on the appointment of Manu Skyttä on February 15, 2024.
Manu Skyttä, New President and CEO of Aspocomp Group Plc, Will Assume Duties on May 20, 2024
03/19/2024 | Globe NewswireManu Skyttä succeeds Mikko Montonen, who, as previously announced, has agreed with the Board of Directors to step down from the role of President and CEO of the company. Mr. Montonen has committed to staying on as the company's President and CEO until May 20, 2024.
Manu Skyttä Appointed as President and CEO of Aspocomp, Mikko Montonen Steps Down
02/19/2024 | AspocompThe Board of Directors of Aspocomp Group Plc has appointed Mr. Manu Skyttä (b. 1975), MSc, Aeronautical Engineering, as President and CEO. Manu succeeds Mr. Mikko Montonen, who has agreed with the Board of Directors of the company that he will step down from the role of President and CEO of the company.