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The Chemical Connection: Through-glass Vias in Glass Substrates

06/24/2025 | Don Ball -- Column: The Chemical Connection
This month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.

In Pursuit of Perfection: Defect Reduction—May 2025 PCB007 Magazine Now Available

05/15/2025 | I-Connect007 Editorial Team
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In the May 2025 issue of PCB007 Magazine, we examine the imaging, etching, and plating processes, as well as product traceability on the shop floor, providing information and insight into how you can reduce your defects and increase yields.

DuPont to Showcase Advanced Semiconductor Wet Etching Innovations at the Surface Preparation and Cleaning Conference

05/13/2025 | DuPont
DuPont announced that it will present its latest developments in semiconductor wet etching technologies at the upcoming Surface Preparation and Cleaning Conference (SPCC) in Chandler, Arizona, beginning May 20.

The Chemical Connection: Common Misconceptions in Wet Processing

04/28/2025 | Don Ball -- Column: The Chemical Connection
Initially, I thought an April Fool’s column would be fun this month. I could highlight some of the crazier ideas and misconceptions I’ve witnessed over the years from potential customers and we could all have a good laugh. For example, there was a first-time buyer of a ferric chloride etcher (with no regeneration system) who was astonished to learn that he had to put fresh etchant in the system occasionally to maintain production.

Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley

04/17/2025 | PRNewswire
Lam Research Corp. announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.
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