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TRI to Reveal 3D Micro Components Inspection Solutions at SEMICON Taiwan 2018
August 13, 2018 | TRIEstimated reading time: 1 minute
TRI will showcase state-of-the-art 3D Automated Micro SMD Inspection Solutions at SEMICON Taiwan 2018. The event will be held at the Nangang Exhibition Center in Taipei, Taiwan, from September 5-7, 2018. Visit TRI at booth # I2100 to discover high-precision inspection for the semiconductor industry.
"We are delighted to share how TRI's newest 3D technology for Zero Escapes and Zero False Calls help our customers achieve microscopic-level inspection and increase production efficiency,” said TRI's VP of Sales and Marketing Jim Lin.
Presenting an integrated solution for the advanced packaging production line, TRI will exhibit the global technology award-winning TR7007Q 3D SPI with Shadow-free Precision Inspection and High Repeatability and Reproducibility. TRI will also showcase the internationally acclaimed 3D DFF AOI TR7700Q with unprecedented 1um High-Resolution. Increase Yield and Reduce Rework with TRI's innovative precise inspection with leading high-speed coaxpress imaging technology. Test Research, Inc.'s Metrology grade inspection is suited for the semiconductor industry that continues to shrink the size of electronic devices. With 1um High Resolution Inspection TRI catches up with the miniaturization trend and ensures higher yields and fewer failure rates in the semiconductor packaging production lines.
Discover TRI's new Micro SMD and Packaging Inspection solutions at booth # l2100 of SEMICON Taiwan 2018.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzer (MDA) and In-Circuit Test (ICT) equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more here.
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