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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Occam Prize Competition for Electronic Design Now Accepting EntriesAugust 14, 2018 | Occam Prize
Estimated reading time: 1 minute
The first annual Occam Prize International Design Competition has begun accepting registrations from circuit designers from around the world. Cash prizes totaling $5,000 will be awarded to top designers in the inaugural year of the planned annual competition.
The purpose of the competition is to incentivize circuit designers everywhere to explore for themselves the prospective benefits associated with the Occam Process, a method for manufacturing electronic assemblies without solder to prospectively make them smaller, lighter, more reliable, more environmentally friendly and much less expensive. It has been estimated by the developers that if all electronics were to be fabricated side stepping the solder assembly process, billions of dollars, perhaps into double digits could be saved annually on a global basis.
Veteran PCB designer Darren Smith, president of AthenaTech, demonstrated the efficacy of the Occam Design and Assembly Process by taking an assembly he had previously designed and redesigning it. Using the approach prescribed for Occam assemblies, Smith was able to take the assembly to less than half the size of the original while reducing layer count from 12 to 6.
For those wishing to better understand the Occam Process, Joe Fjelstad's eBook, “Solderless Assembly for Electronics – The SAFE Approach," is available for free download.
The Occam Prize will be awarded annually on December 21, Winter Solstice, the day the Northern Hemisphere begins to transition from days of darkness to days of light. Registrations open on August 14, 2018 and will close on November 30, 2018.
Sponsors presently include: AthenaTech - USA, CETTI - Romania, I-Connect007 - USA, MEPTEC - USA, Micropress - Brazil, Promex Industries - USA, Rainbow Technologies - Scotland, Verdant Electronics - USA, Tatsuta - Japan, Topline Industries - USA, Terecircuits - USA, UP Media - USA, and Zero Defects - USA.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Dynamic Grid has ordered a Hentec Industries/RPS Valence 3508 selective soldering system.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on March 7 at Sweeney Barn in Manassas, Virginia.
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 μm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. Learn about this method…
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.