-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Occam Prize Competition for Electronic Design Now Accepting Entries
August 14, 2018 | Occam PrizeEstimated reading time: 1 minute
The first annual Occam Prize International Design Competition has begun accepting registrations from circuit designers from around the world. Cash prizes totaling $5,000 will be awarded to top designers in the inaugural year of the planned annual competition.
The purpose of the competition is to incentivize circuit designers everywhere to explore for themselves the prospective benefits associated with the Occam Process, a method for manufacturing electronic assemblies without solder to prospectively make them smaller, lighter, more reliable, more environmentally friendly and much less expensive. It has been estimated by the developers that if all electronics were to be fabricated side stepping the solder assembly process, billions of dollars, perhaps into double digits could be saved annually on a global basis.
Veteran PCB designer Darren Smith, president of AthenaTech, demonstrated the efficacy of the Occam Design and Assembly Process by taking an assembly he had previously designed and redesigning it. Using the approach prescribed for Occam assemblies, Smith was able to take the assembly to less than half the size of the original while reducing layer count from 12 to 6.
For those wishing to better understand the Occam Process, Joe Fjelstad's eBook, “Solderless Assembly for Electronics – The SAFE Approach," is available for free download.
The Occam Prize will be awarded annually on December 21, Winter Solstice, the day the Northern Hemisphere begins to transition from days of darkness to days of light. Registrations open on August 14, 2018 and will close on November 30, 2018.
Sponsors presently include: AthenaTech - USA, CETTI - Romania, I-Connect007 - USA, MEPTEC - USA, Micropress - Brazil, Promex Industries - USA, Rainbow Technologies - Scotland, Verdant Electronics - USA, Tatsuta - Japan, Topline Industries - USA, Terecircuits - USA, UP Media - USA, and Zero Defects - USA.
Details about the Occam Prize and how to register can be found on the Occam Prize website or by contacting Info@OccamPrize.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
AIM Solder Hires Francisco Rodriguez as Regional Sales Manager for Northeast Mexico
03/09/2026 | AIM SolderAIM Solder is pleased to hire Francisco Rodriguez as Regional Sales Manager for Northeast Mexico.
SMTA International 2025 Conference Awards Announced
03/09/2026 | SMTAThe SMTA is pleased to announce the technical conference awards from SMTA International 2025. The winners were selected by members of the conference technical committee.
SolderKing Expands Solder Paste Range with SAC0307 Low-Silver Alloy Option
03/05/2026 | SolderKingSolderKing Assembly Materials has launched SAC0307, a new low-silver addition to its SK P2-5 solder paste range.
KOKI Showcases BIG Low-Ag and ICT-ready Solutions at APEX EXPO 2026
03/05/2026 | KOKIKOKI Solder America, a global leader in advanced soldering materialsannounces that it will be exhibiting at APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California.
Microscreen Expands New England Coverage for High-Precision SMT Stencils
03/04/2026 | MicroscreenMicroscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, has appointed Yankee Soldering Technology as its representative firm for the New England region.