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Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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Indium’s Geoff Wang to Present at IPC Electronics Assembly High-Reliability Tech Conference
August 14, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation’s Geoff Wang, area technical manager for SMT, will share his technical expertise at the 2018 IPC Electronics Assembly High-Reliability Technology Conference on August 23 in Chengdu, China.
Wang’s presentation, "The Impact of Solder Materials on Reliability," will show how materials can be used to solve some of the top challenges in the industry, including HIP, NWO, graping, and SIR performance.
Wang is based in Zhongshan, Guangdong, and provides technical support throughout southern China. He has more than a decade of SMT experience.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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