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Indium Features Solder Paste for Fine Feature Printing at SEMICON Taiwan
August 16, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2018 September 5-7 in Taipei, Taiwan.
Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporation’s Type 6SG powder is ideal for fine feature printing applications.
Indium3.2HF offers consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:
- Good response-to-pause
- A wide reflow profile window
- Outstanding slump resistance
- Excellent wetting capability
- Superior fine-pitch soldering ability
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.
For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, click here or visit Indium Corporation’s booth J2240.
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