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IPC E-Textiles Committee Releases White Paper on Washability of E-Textiles
August 17, 2018 | IPCEstimated reading time: 2 minutes
IPC’s D-70 E-Textiles Committee has released IPC WP-024, IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market. This white paper provides insights from a team of researchers on e-textiles washability testing parameters and initial results from those tests. The D-70 committee plans for IPC-WP-024 to be the first in a series of papers from industry.
Current research in smart textiles and e-textiles indicates that they are not yet ready for the market at a large scale due to problems that exist with reliability and the difficulty with laundering e-textile structures. Specific to reliability, e-textile structures should be in good functioning condition over a period of several years, if used in accordance with product guidelines. However, the additional issues of integration, connector elements, and overall supply chain integration are critical for success. IPC-WP-024 emphasizes all the problems inherent in creating effective e-textiles, encompassing efforts that industry and research laboratories must undertake to make e-textile structures more robust.
The D-70 committee invites readers to also provide white papers with their own findings and perspectives on e-textiles washability reliability.
Chair of the IPC D-70 Committee, Stephanie Rodgers of Apex Mills says, “Home laundering and commercial cleaning is an everyday reality for millions of textile wearable products. Explosive growth in e-textiles is just starting to break through performance market segments making standardization urgently necessary. This e-textile laundering research identifies with the procedure and requirements gap of these merging manufacturing technologies. The IPC E-Textiles Committee is corralling industry manufacturers to participate in the discussion of new e-textiles standards creation.”
IPC-WP-024 will be provided free of charge to all IPC E-Textiles 2018 attendees. The D-70 committee plans to discuss how standards should address washability reliability during the standards committee forum, which will take place September 12, 2018, the day before E-Textiles 2018. To register for IPC E-Textiles 2018, click here.
For more information or to purchase WP-024, IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for the Market, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.