Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
MIRTEC Enters Tech Collaboration Agreement with YXLON and The Comet Group
August 20, 2018 | MirtecEstimated reading time: 2 minutes
MIRTEC has entered into a technical collaboration agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT electronics manufacturing industry.
Pictured above, MIRTEC and YXLON equipment are on display at the Comet Group Lab ONE facility in San Jose, California. This new ‘Center of Excellence’ gives customers the opportunity to enjoy hands-on experience and demonstrations with MIRTEC’s latest solder paste inspection (SPI) and automated optical inspection (AOI) Systems in conjunction with YXLON’s state-of-the-art Automated x-ray inspection (AXI) technology. These systems are fully integrated with the SmartLoop yield improvement system.
MIRTEC, together with YXLON, have delivered a game-changing Industry 4.0 solution. SmartLoop links MIRTEC’s in-line 3D AOI with the YXLON’s at-line digital x-ray system, allowing data to flow between them seamlessly.
“3D AOI can only measure differences in Z-height on devices like BGAs and make a guestimate as to the quality of the joints underneath and the need for rework. With SmartLoop, the at-line x-ray system now becomes a verification station for the 3D height measurements taken by the AOI system. X-Ray inspection time is also dramatically reduced by targeting only suspect regions of interest that the system automatically selects for inspection. Full data integration gives the technician the tools needed for correct decisions, intelligent feedback and process improvements,” said Keith Bryant, YXLON global director of electronics sales.
“We are very excited to partner with YXLON and the Comet Group. Our intention is to collaborate on new inspection solutions for the Electronic Manufacturing Industry, combining the strengths of MIRTEC’s Award Winning 3D Inspection Technology with YXLON International’s advanced X-ray and CT inspection systems. These new solutions will provide our valued customers with leading-edge inspection capabilities required in the production of complex electronic assemblies and help pave the way toward Industry 4.0 through collaborative data integration. We look forward to a long and prosperous relationship between our organizations,” said Brian D’Amico, president of MIRTEC’s North American Sales and Service Division.
About MIRTEC
MIRTEC has earned a solid reputation with leading OEM and EMS companies throughout the world for its technologically advanced 3D inspection technology. MIRTEC products have been extremely successful in high-volume markets including cell phone and MP3 player manufacturing, as well as low-volume high-mix markets such as medical, automotive, aerospace and defense. For more information, click here.
About YXLON
YXLON, company of the Comet Group, designs and produces radioscopic and CT inspection systems for a broad variety of industrial applications and fields. Whether in the aviation and aerospace, automotive, or electronics industry, YXLON customers are among the largest manufacturers in the world. For more information, click here.
About COMET Group
The COMET Group is a globally leading, innovative Swiss technology company with a focus on the x-ray, radio frequency and ebeam businesses. With premium high-tech components and systems, we enable customers in numerous industries to both enhance the quality of their products and make their manufacturing more efficient and eco-friendly. Our innovative solutions under the COMET, YXLON and ebeam brands are in demand for applications such as materials testing and security inspection, the coating and treatment of surfaces, and non-contact sterilization. Based in Flamatt, Switzerland, the COMET Group has a presence in all world markets. We employ about 1,300 people worldwide, including approximately 440 in Switzerland. Besides production facilities in China, Denmark, Germany, Switzerland and the USA, we maintain various subsidiaries in the USA, China, Japan and Korea. COMET’s stock (COTN) is listed on the SIX Swiss Exchange. For more information, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.