Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Impact of PCB Dielectric Thickness on Signal Crosstalk
August 27, 2018 | Chang Fei Yee, Keysight TechnologiesEstimated reading time: Less than a minute
This article studies the impact of dielectric thickness on crosstalk for transmission lines in single-ended and differential mode on outer (microstrip) and inner (stripline) PCB layers. Crosstalk analysis is performed in 2D simulation and S-parameters are subsequently observed.
Introduction to Crosstalk
Crosstalk is an unintentional electromagnetic (EM) field coupling between transmission lines on a PCB. This phenomenon becomes a major culprit in signal integrity (SI), contributing to the rise of bit error occurrence in data communications and electromagnetic interference (EMI). With the existence of mutual inductance and capacitance between two adjacent transmission lines on a PCB, crosstalk has become more severe due to the shorter signal rise/fall times at today’s higher data speed rates.
Crosstalk can be minimized by routing the PCB traces further apart and reducing the dielectric thickness between PCB trace and reference plane. We will observe how a PCB’s dielectric thickness affects the signal crosstalk. All crosstalk analyses are carried out in 2D simulation using Mentor’s HyperLynx.
To read this entire article, which appeared in the August 2018 issue of Design007 Magazine, click here.
Share on:
Suggested Items
NASA’s Europa Clipper: Millions of Miles Down, Instruments Deploying
11/26/2024 | NASAHeaded to Jupiter’s moon Europa, the spacecraft is operating without a hitch and will reach Mars in just three months for a gravity assist.
At Schneider Electric, Future of MES/MOM Lies in the Cloud
11/26/2024 | Schneider ElectricSchneider Electric’s mission is to be the trusted partner for sustainability and efficiency. The company is helping customers across industries unlock efficiency, productivity, and resilience through digital transformation. Schneider Electric is also accelerating its own digital transformation across production facilities.
HPC Customer Engages Sondrel for High End Chip Design
11/25/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.
Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24
11/25/2024 | Compal Electronics Inc.Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.
Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets
11/21/2024 | Keysight TechnologiesKeysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.