-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24
November 25, 2024 | Compal Electronics Inc.Estimated reading time: 2 minutes
Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions. This partnership sets a new benchmark for sustainable, high-performance data center solutions to address the evolving needs of high-performance computing (HPC) and artificial intelligence (AI) applications. Their joint innovations will take center stage at Supercomputing 2024 (SC24), providing the industry with fresh insights into cutting-edge technologies and practical applications.
At SC24, Compal will unveil the SD221-8A-L server, the flagship solution born from this collaboration. The SD221-8A-L is a 2U 4-node high-density design platform with direct liquid cooling (DLC) capabilities, supporting high processor TDP for demanding workloads. Its innovative front-access serviceability eliminates the need to unplug and replug DLC connections at the rear of the chassis, significantly streamlining maintenance and reducing downtime. The front I/O design also preserves PCIe slot spacing, ensuring seamless integration of DLC harnesses without compromising expandability. These thoughtful engineering choices ensure optimal performance, reliability, and operational efficiency.
This server's vital breakthrough is the integration of ZutaCore’s HyperCool® system, a revolutionary waterless two-phase liquid cooling solution for AI factories. HyperCool dramatically reduces water usage in the data center, enabling the highest sustained performance, server densification, and reduced power usage, which is critical for meeting the power demands of today’s AI, HPC, and ML workloads.
Recognizing the specific challenges faced by data centers in water-scarce regions, Compal has leveraged its market insights to promote ZutaCore HyperCool in the Middle East and India. Early customer feedback highlights the system's environmental benefits, high efficiency, and operational stability, establishing it as an ideal solution for next-generation data center demands.
Compal’s announcement of the SD221-8A-L marks a significant milestone for two-phase liquid cooling in data centers. This launch not only underscores the shared commitment of Compal and ZutaCore to advancing green computing but also reflects their dedication to delivering high-performance, sustainable solutions to the global market. Moving forward, both companies plan to deepen their collaboration and introduce more comprehensive liquid cooling server solutions tailored to industry needs.
For more information and to experience these groundbreaking technologies firsthand, visit Compal at booth #3941 and ZutaCore at booth #545 during SC24. For the latest updates and detailed insights into their innovative solutions, stay tuned to Compal Server's and ZutaCore’s website and social media channels.
Suggested Items
Compal Honored with Sustainability Awards
12/11/2024 | Compal Electronics Inc.The 2024 17th TCSA Taiwan Corporate Sustainability Awards held its joint award ceremony today (11th). Compal was honored with two prestigious awards: the "Taiwan Top 100 Sustainability Model Enterprise Award" and the "Taiwan Sustainability Report – Platinum Award." Mr. Jack Wang, Vice President and Deputy Chief Sustainability Officer, represented the company to accept the honors.
Compal Posts Sales Report for November 2024
12/09/2024 | Compal Electronics Inc.Compal Electronics reported Nov 2024 consolidated revenue of NT$79,666mn, representing MoM decrease of 6.8% and YoY decrease of 5.9%. The accumulated revenue of 2024 was NT$846,216mn, representing YoY decrease of 3.5%.
Compal Collaborates with Viasat
12/02/2024 | Compal Electronics Inc.Compal Electronics, Inc. (Compal) announced the collaboration with Viasat, a global leader in satellite communications, to officially include the APAL Hestia NTN IoT Dongle in Viasat’s ELEVATE Marketplace, further driving innovative applications of satellite Internet of Things (IoT) technology.
Compal Reports Solid September 2024 Sales, Maintains Growth Trajectory
10/14/2024 | Compal Electronics Inc.Compal Electronics Inc. announced consolidated revenue of NT$83.766 million for September 2024.
Compal RMM-T1 Module Achieves Skylo Certification and FCC Approval
09/20/2024 | Compal Electronics Inc.Compal is pleased to announce that its RMM-T1 module has successfully obtained Skylo certification and received approval from the Federal Communications Commission (FCC).