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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Mentor White Paper--Concepts of Power Integrity: Controlling Impedance Across a Bare Cavity
August 27, 2018 | Fadi Deek, Mentor, a Siemens BusinessEstimated reading time: 1 minute
The power distribution network (PDN) is the path from the power supply source (VRM) to the ICs (active devices). At low impedance, the PDN delivers adequate current to the receiver, enabling the PCB to function as desired.
Without a low-impedance path across the PDN, noise can propagate throughout a PCB, causing bit errors, voltage ripples, timing violations, and more. This white paper by Fadi Deek of Mentor, a Siemens Business, examines how impedance can be controlled in the PDN cavity.
To download this free white paper, click here.
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Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.
Road to Reliability: Engineering High Uptime EV Charging Infrastructure
05/13/2026 | Stanton Rak, SF Rak CompanyThe transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.
SINBON Electronics, Nexcellent Energy Partner on Urban Hydrogen Energy
05/13/2026 | PRNewswire"We have always believed in working with partners who share the same vision," said Alex Shiung, Business Development Assistant Vice President at SINBON. "Together, we hope to build an ecosystem that is friendly to the environment and beneficial for the planet."
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
Casimir Launches With $12M Seed Round for Quantum Energy Chip
05/12/2026 | BUSINESS WIRECasimir, Inc., a quantum energy technology company founded by former NASA advanced propulsion researcher Dr. Harold “Sonny” White, today announced the close of a $12 million seed round led by Scout Ventures.