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CyberOptics Showcases All-in-One Relative Humidity, Leveling and Vibration Measurement Sensor for Reticle Environments at SPIE
August 27, 2018 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics Corporation will demonstrate its ReticleSense Auto Multi Sensor (AMSR) – the world’s most efficient and effective wireless measurement devices for semiconductor fabs and equipment OEMs at the SPIE PhotoMask Technology and EUV Lithography conference, September 17-20 at the Monterey Conference Center in California in booth #104.
ReticleSense Auto Multi Sensors (AMSR) measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device. The AMSR speeds equipment qualification, shortens equipment maintenance cycles and lowers equipment maintenance expenses. Multiple measurements can be captured and monitored in all locations of the reticle environment, saving equipment engineers or process engineers’ time and expense.
CyberOptics will also demonstrate the ReticleSense Airborne Particle Sensor (APSRQ) that speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. Engineers can save time by swiftly locating contamination sources and see the effect of cleanings, adjustments and repairs.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
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Brent Fischthal - Koh YoungSuggested Items
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Marco Pieters Appointed ASML Chief Technology Officer
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I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
EDADOC Ushers in a New Era of Robotics Innovation
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