Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
CyberOptics Showcases All-in-One Relative Humidity, Leveling and Vibration Measurement Sensor for Reticle Environments at SPIE
August 27, 2018 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics Corporation will demonstrate its ReticleSense Auto Multi Sensor (AMSR) – the world’s most efficient and effective wireless measurement devices for semiconductor fabs and equipment OEMs at the SPIE PhotoMask Technology and EUV Lithography conference, September 17-20 at the Monterey Conference Center in California in booth #104.
ReticleSense Auto Multi Sensors (AMSR) measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device. The AMSR speeds equipment qualification, shortens equipment maintenance cycles and lowers equipment maintenance expenses. Multiple measurements can be captured and monitored in all locations of the reticle environment, saving equipment engineers or process engineers’ time and expense.
CyberOptics will also demonstrate the ReticleSense Airborne Particle Sensor (APSRQ) that speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. Engineers can save time by swiftly locating contamination sources and see the effect of cleanings, adjustments and repairs.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.